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参数资料
| 型号： | MC74HC597ADTR2 |
| 厂商： | ON SEMICONDUCTOR |
| 元件分类： | 计数移位寄存器 |
| 英文描述： | HC/UH SERIES, 8-BIT RIGHT PARALLEL IN SERIAL OUT SHIFT REGISTER, TRUE OUTPUT, PDSO16 |
| 封装： | PLASTIC, TSSOP-16 |
| 文件页数： | 2/11页 |
| 文件大小： | 291K |
| 代理商： | MC74HC597ADTR2 |
MC54/74HC597A
MOTOROLA
High–Speed CMOS Logic Data
DL129 — Rev 6
10
OUTLINE DIMENSIONS
J SUFFIX
CERAMIC PACKAGE
CASE 620–10
ISSUE V
N SUFFIX
PLASTIC PACKAGE
CASE 648–08
ISSUE R
19.05
6.10
—
0.39
1.40
0.21
3.18
19.93
7.49
5.08
0.50
1.65
0.38
4.31
0
°
0.51
15
°
1.01
1.27 BSC
2.54 BSC
7.62 BSC
MIN
MAX
INCHES
MILLIMETERS
DIM
0.750
0.240
—
0.015
0.055
0.008
0.125
0.785
0.295
0.200
0.020
0.065
0.015
0.170
0.050 BSC
0.100 BSC
0.300 BSC
A
B
C
D
E
F
G
J
K
L
M
N
0
°
0.020
15
°
0.040
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIM F MAY NARROW TO 0.76 (0.030) WHERE
THE LEAD ENTERS THE CERAMIC BODY.
1
8
9
16
–A
–
–B
–
C
K
N
G
E
F
D 16 PL
–T
–
SEATING
PLANE
M
L
J 16 PL
0.25 (0.010)
T
A
M
S
0.25 (0.010)
T
B
M
S
MIN
MAX
INCHES
MILLIMETERS
DIM
A
B
C
D
F
G
H
J
K
L
M
S
18.80
6.35
3.69
0.39
1.02
0.21
2.80
7.50
0
°
0.51
19.55
6.85
4.44
0.53
1.77
0.38
3.30
7.74
10
°
1.01
0.740
0.250
0.145
0.015
0.040
0.008
0.110
0.295
0
°
0.020
0.770
0.270
0.175
0.021
0.070
0.015
0.130
0.305
10
°
0.040
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
2.54 BSC
1.27 BSC
0.100 BSC
0.050 BSC
–A
–
B
1
8
9
16
F
H
G
D 16 PL
S
C
–T
–
SEATING
PLANE
K
J
M
L
T
A
0.25 (0.010) M
M
0.25 (0.010)
T
B
A
M
S
MIN
MAX
MILLIMETERS
INCHES
DIM
A
B
C
D
F
G
J
K
M
P
R
9.80
3.80
1.35
0.35
0.40
0.19
0.10
0
°
5.80
0.25
10.00
4.00
1.75
0.49
1.25
0.25
7
°
6.20
0.50
0.386
0.150
0.054
0.014
0.016
0.008
0.004
0
°
0.229
0.010
0.393
0.157
0.068
0.019
0.049
0.009
7
°
0.244
0.019
1.27 BSC
0.050 BSC
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
1
8
9
16
–A
–
–B
–
D 16 PL
K
C
G
–T
–
SEATING
PLANE
R X 45
°
M
J
F
P 8 PL
0.25 (0.010)
B
M
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751B–05
ISSUE J
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MC74HC597ADTR2G | 功能描述:计数器移位寄存器 IC SHIFT REGISTER 8-BIT RoHS:否 制造商:Texas Instruments 计数器类型: 计数顺序:Serial to Serial/Parallel 电路数量:1 封装 / 箱体:SOIC-20 Wide 逻辑系列: 逻辑类型: 输入线路数量:1 输出类型:Open Drain 传播延迟时间:650 ns 最大工作温度:+ 125 C 最小工作温度:- 40 C 封装:Reel |
| MC74HC597AF | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
| MC74HC597D | 制造商:Motorola Inc 功能描述: |
| MC74HC597N | 制造商:Motorola Inc 功能描述: 制造商:Motorola Inc 功能描述:Shift Register, 16 Pin, Plastic, DIP |
| MC74HC640ADT | 制造商:Rochester Electronics LLC 功能描述:- Tape and Reel 制造商:ON Semiconductor 功能描述: |
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