参数资料
型号: MC74HCT259ADG
厂商: ON Semiconductor
文件页数: 2/9页
文件大小: 0K
描述: 8-BIT ADDRESSABLE LATCH
标准包装: 48
系列: 74HCT
逻辑类型: D 型,可寻址
电路: 1:8
输出类型: 标准
电源电压: 4.5 V ~ 5.5 V
独立电路: 1
延迟时间 - 传输: 42ns
输出电流高,低: 5.2mA,5.2mA
工作温度: -55°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 16-SOIC(0.154",3.90mm 宽)
供应商设备封装: 16-SOIC
包装: 管件
MC74HCT259A
http://onsemi.com
2
Figure 1. Logic Diagram
ADDRESS
INPUTS
A0
A1
A2
DATA IN
RESET
ENABLE
14
15
13
3
2
1
12
11
10
9
7
6
5
4
Q0
Q1
Q2
Q3
Q4
Q5
Q6
Q7
PIN 16 = VCC
PIN 8 = GND
NONINVERTING
OUTPUTS
LATCH SELECTION TABLE
Address Inputs
Latch Addressed
C
B
A
L
H
L
H
L
H
L
H
L
H
L
H
L
H
Q0
Q1
Q2
Q3
Q4
Q5
Q6
Q7
MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
VCC
DC Supply Voltage (Referenced to GND)
0.5 to +7.0
V
Vin
DC Input Voltage (Referenced to GND)
0.5 to VCC + 0.5
V
Vout
DC Output Voltage (Referenced to GND)
0.5 to VCC + 0.5
V
Iin
DC Input Current, per Pin
±20
mA
Iout
DC Output Current, per Pin
±25
mA
ICC
DC Supply Current, VCC and GND Pins
±50
mA
PD
Power Dissipation in Still Air,
SOIC Package
TSSOP Package
500
450
mW
Tstg
Storage Temperature
65 to + 150
°C
VESD
ESD Withstand Voltage
Human Body Model (Note 1)
Machine Model (Note 2)
>2000
>200
V
ILatchup Latchup Performance Above VDD and Below GND at
125°C (Note 3)
±100
mA
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress
ratings only. Functional operation above the Recommended Operating Conditions is not implied.
Extended exposure to stresses above the Recommended Operating Conditions may affect device
reliability.
1. Tested to EIA / JESD22A114A.
2. Tested to EIA / JESD22A115A.
3. Tested to EIA / JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
Max
Unit
VCC
DC Supply Voltage (Referenced to GND)
4.5
5.5
V
Vin, Vout
DC Input Voltage, Output Voltage (Referenced to GND)
0
VCC
V
TA
Operating Temperature, All Package Types
55
+125
°C
tr, tf
Input Rise and Fall Time (Figure 2)
0
500
ns
This device contains protection
circuitry to guard against damage
due to high static voltages or electric
fields. However, precautions must
be taken to avoid applications of any
voltage higher than maximum rated
voltages to this highimpedance cir-
cuit. For proper operation, Vin and
Vout should be constrained to the
range GND v (Vin or Vout) v VCC.
Unused inputs must always be
tied to an appropriate logic voltage
level (e.g., either GND or VCC).
Unused outputs must be left open.
相关PDF资料
PDF描述
OSTHI030050 CONN TERM BLOCK 3POS 5MM
OSTKR030100 TERM BLOCK PLUG 5.00MM 3POS
OSTVK095050 CONN TERM BLK HEADER 9POS 5.08MM
OSTVK095150 CONN HEADER 9PS 5.08MM 45DEG PCB
OSTVK097150 CONN HEADER 9POS 5.0MM 45DEG PCB
相关代理商/技术参数
参数描述
MC74HCT259ADR2G 功能描述:闭锁 8-BIT ADDRESSABLE LATCH RoHS:否 制造商:Micrel 电路数量:1 逻辑类型:CMOS 逻辑系列:TTL 极性:Non-Inverting 输出线路数量:9 高电平输出电流: 低电平输出电流: 传播延迟时间: 电源电压-最大:12 V 电源电压-最小:5 V 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装 / 箱体:SOIC-16 封装:Reel
MC74HCT259ADTG 功能描述:闭锁 8-BIT ADDRESSABLE LATCH RoHS:否 制造商:Micrel 电路数量:1 逻辑类型:CMOS 逻辑系列:TTL 极性:Non-Inverting 输出线路数量:9 高电平输出电流: 低电平输出电流: 传播延迟时间: 电源电压-最大:12 V 电源电压-最小:5 V 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装 / 箱体:SOIC-16 封装:Reel
MC74HCT259ADTR2G 功能描述:闭锁 8-BIT ADDRESSABLE LATCH RoHS:否 制造商:Micrel 电路数量:1 逻辑类型:CMOS 逻辑系列:TTL 极性:Non-Inverting 输出线路数量:9 高电平输出电流: 低电平输出电流: 传播延迟时间: 电源电压-最大:12 V 电源电压-最小:5 V 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装 / 箱体:SOIC-16 封装:Reel
MC74HCT273ADTR2 功能描述:触发器 5V CMOS Octal RoHS:否 制造商:Texas Instruments 电路数量:2 逻辑系列:SN74 逻辑类型:D-Type Flip-Flop 极性:Inverting, Non-Inverting 输入类型:CMOS 输出类型: 传播延迟时间:4.4 ns 高电平输出电流:- 16 mA 低电平输出电流:16 mA 电源电压-最大:5.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:X2SON-8 封装:Reel
MC74HCT273ADTR2G 功能描述:触发器 5V CMOS Octal D-Type RoHS:否 制造商:Texas Instruments 电路数量:2 逻辑系列:SN74 逻辑类型:D-Type Flip-Flop 极性:Inverting, Non-Inverting 输入类型:CMOS 输出类型: 传播延迟时间:4.4 ns 高电平输出电流:- 16 mA 低电平输出电流:16 mA 电源电压-最大:5.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:X2SON-8 封装:Reel