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参数资料
| 型号： | MC74LCX543DW |
| 厂商： | ON SEMICONDUCTOR |
| 元件分类： | 总线收发器 |
| 英文描述： | LVC/LCX/Z SERIES, 8-BIT REGISTERED TRANSCEIVER, TRUE OUTPUT, PDSO24 |
| 封装： | PLASTIC, SOIC-24 |
| 文件页数： | 33/42页 |
| 文件大小： | 360K |
| 代理商： | MC74LCX543DW |
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Reliability Information
MOTOROLA
LCX DATA
BR1339 — REV 3
250
System Considerations
The manner in which an IC package is mounted and
positioned in its surrounding environment will have
significant effects on operating junction temperatures.
These conditions are under the control of the system
designer and are worthy of serious consideration in PC
board layout and system ventilation and airflow.
Forced–air cooling will significantly reduce
ΘJA. Air flow
parallel to the long dimension of the package is generally a
few percent more effective than air flow perpendicular to the
long dimension of the package. In actual board layouts, other
components can provide air flow blocking and flow
turbulence, which may reflect the net reduction of
ΘJA of a
specific component.
External heat sinks applied to an IC package can improve
thermal resistance by increasing heat flow to the ambient
environment. Heat sink performance will vary by size,
material, design, and system air flow. Heat sinks can provide
a substantial improvement.
Package mounting can affect thermal resistance. Surface
mount packages dissipate significant amounts of heat
through the leads. Improving heat flow from package leads to
ambient will decrease thermal resistance.
Metal (copper) traces on PC boards conduct heat away
from the package and dissipate it to the ambient; thus the
larger the trace area the lower the thermal resistance.
Package stand–off has a small effect on ΘJA. Boards with
higher thermal conductivity (ceramic) may show the most
pronounced benefit.
The use of thermally conductive adhesive under SO
packages can lower thermal resistance by providing a
direct heat flow path from the package to board. Naturally
high thermal conductivity board material and/or cool board
temperatures amplify this effect.
High thermal conductive board material will decrease
thermal resistance. A change in board material from epoxy
laminate to ceramic will help reduce thermal resistance.
Conclusion
Thermal management remains a major concern of
producers and users of IC’s. An increase in
ΘJA is the major
trade–off one must accept for package miniaturization. When
the user considers all of the variables that affect the IC
junction temperature, he is then prepared to take maximum
advantage of the tools, materials and data that are available.
References
1. “High Performance ECL Data – ECLinPS and ECLinPS Lite,” Motorola, pp. 4–32.
2. “Thermal Considerations for Advanced Logic Families; AN241,” Philips
Semiconductors
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相关代理商/技术参数 |
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| MC74LCX573DT | 功能描述:闭锁 2-3.6V Octal 3-State RoHS:否 制造商:Micrel 电路数量:1 逻辑类型:CMOS 逻辑系列:TTL 极性:Non-Inverting 输出线路数量:9 高电平输出电流: 低电平输出电流: 传播延迟时间: 电源电压-最大:12 V 电源电压-最小:5 V 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装 / 箱体:SOIC-16 封装:Reel |
| MC74LCX573DTG | 功能描述:闭锁 2-3.6V Octal 3-State Transparent RoHS:否 制造商:Micrel 电路数量:1 逻辑类型:CMOS 逻辑系列:TTL 极性:Non-Inverting 输出线路数量:9 高电平输出电流: 低电平输出电流: 传播延迟时间: 电源电压-最大:12 V 电源电压-最小:5 V 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装 / 箱体:SOIC-16 封装:Reel |
| MC74LCX573DTR2 | 功能描述:闭锁 2-3.6V Octal 3-State RoHS:否 制造商:Micrel 电路数量:1 逻辑类型:CMOS 逻辑系列:TTL 极性:Non-Inverting 输出线路数量:9 高电平输出电流: 低电平输出电流: 传播延迟时间: 电源电压-最大:12 V 电源电压-最小:5 V 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装 / 箱体:SOIC-16 封装:Reel |
| MC74LCX573DTR2G | 功能描述:闭锁 2-3.6V Octal 3-State Transparent RoHS:否 制造商:Micrel 电路数量:1 逻辑类型:CMOS 逻辑系列:TTL 极性:Non-Inverting 输出线路数量:9 高电平输出电流: 低电平输出电流: 传播延迟时间: 电源电压-最大:12 V 电源电压-最小:5 V 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装 / 箱体:SOIC-16 封装:Reel |
| MC74LCX573DW | 功能描述:闭锁 2-3.6V Octal 3-State RoHS:否 制造商:Micrel 电路数量:1 逻辑类型:CMOS 逻辑系列:TTL 极性:Non-Inverting 输出线路数量:9 高电平输出电流: 低电平输出电流: 传播延迟时间: 电源电压-最大:12 V 电源电压-最小:5 V 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装 / 箱体:SOIC-16 封装:Reel |
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