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参数资料
| 型号： | MC74VHC1G00DTT3 |
| 厂商： | ON SEMICONDUCTOR |
| 元件分类： | 门电路 |
| 英文描述： | AHC/VHC SERIES, 2-INPUT NAND GATE, PDSO5 |
| 封装： | SC-59, SOT-23, TSOP-5 |
| 文件页数： | 24/28页 |
| 文件大小： | 153K |
| 代理商： | MC74VHC1G00DTT3 |
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Semiconductor Components Industries, LLC, 2001
January, 2001 – Rev. 2
164
Publication Order Number:
AND8004/D
AND8004/D
ON Semiconductor Logic
Date Code and Traceability
Marking
Douglas Buzard, Logic Product Engineering
Introduction
This is a summary of ON Semiconductor MOS Logic Device, Date Code, and Traceability Marking. We want to provide
our customers with easy access to this information on the web. This applications note summarizes and explains the Date Code
and Traceability Marking for Logic packages. This is not intended to replace the proper documentation. To properly decode
the Logic marking you need 12MRH00191A ON Semiconductor marking spec, and S.O.P. 7–19 ID of Products to Location
of Test/Assy/Wafer Fab. Also, you need to know the abbreviations used for Logic products(see the appropriate Logic datasheet
for the specific device naming/ordering information).
Device Marking
MOS Logic Families
The standard Logic abbreviations are:
LS
= Low Power Schottky Logic
14xxx
= Metal Gate CMOS Logic
HC, HCT
= High Speed CMOS Logic
AC, ACT, JLC
= FACT – Fairchild Advanced CMOS Technology
VHC, VHCT
= Very High Speed CMOS Logic
LVX, LVXT
= Low–Voltage Very High Speed CMOS
LCX
= Low–Voltage CMOS Logic
VCX
= Advanced Low–Voltage CMOS Logic
MOS Logic Packages
The standard Logic package suffixes are:
N = Plastic Dual–In–Line
P = Metal Gate CMOS Plastic Dual–In–Line
D = 8/14/16 SOIC Narrow Body
DW = 16/20/24 SOIC Wide Body
F = EIAJ Plastic Mini Flat Pack
M = EIAJ Plastic Mini Flat Pack
DT = 8/10/14/16/20/24/48/56 TSSOP or TSOP5 or TSOP6
DF = SOT–353/363 or SC–88A/SC–88
V = VSOP8/VTSOP8/US8
S = VTSSOP–8/SM8
All of the above except DF, F, and M can be combined with an R2 suffix for tape and reel. The tape and reel suffixes for
EIAJ Plastic Mini Flat Pack include EL, L1, L2, F1, F2 depending upon the type of tape and the orientation of the part in the
tape pocket. The DF package can be combined with a T1, T2, or R2 tape and reel suffix that specifies the orientation of the
part in the tape pocket and the number of devices per reel.
http://onsemi.com
APPLICATION NOTE
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MC74VHC1G00TT1G | 制造商:ON Semiconductor 功能描述: |
| MC74VHC1G01DFT1 | 功能描述:逻辑门 2-5.5V Single NAND RoHS:否 制造商:Texas Instruments 产品:OR 逻辑系列:LVC 栅极数量:2 线路数量（输入/输出）:2 / 1 高电平输出电流:- 16 mA 低电平输出电流:16 mA 传播延迟时间:3.8 ns 电源电压-最大:5.5 V 电源电压-最小:1.65 V 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:DCU-8 封装:Reel |
| MC74VHC1G01DFT1G | 功能描述:逻辑门 2-5.5V Single NAND 2-Input w/Open Drain RoHS:否 制造商:Texas Instruments 产品:OR 逻辑系列:LVC 栅极数量:2 线路数量（输入/输出）:2 / 1 高电平输出电流:- 16 mA 低电平输出电流:16 mA 传播延迟时间:3.8 ns 电源电压-最大:5.5 V 电源电压-最小:1.65 V 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:DCU-8 封装:Reel |
| MC74VHC1G01DFT2 | 功能描述:逻辑门 2-5.5V Single NAND RoHS:否 制造商:Texas Instruments 产品:OR 逻辑系列:LVC 栅极数量:2 线路数量（输入/输出）:2 / 1 高电平输出电流:- 16 mA 低电平输出电流:16 mA 传播延迟时间:3.8 ns 电源电压-最大:5.5 V 电源电压-最小:1.65 V 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:DCU-8 封装:Reel |
| MC74VHC1G01DFT2G | 功能描述:逻辑门 2-5.5V Single NAND 2-Input w/Open Drain RoHS:否 制造商:Texas Instruments 产品:OR 逻辑系列:LVC 栅极数量:2 线路数量（输入/输出）:2 / 1 高电平输出电流:- 16 mA 低电平输出电流:16 mA 传播延迟时间:3.8 ns 电源电压-最大:5.5 V 电源电压-最小:1.65 V 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:DCU-8 封装:Reel |
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