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参数资料
| 型号： | MC74VHC1G01DFT1G |
| 厂商： | ON SEMICONDUCTOR |
| 元件分类： | 通用总线功能 |
| 英文描述： | 2-Input NAND Gate with Open Drain Output |
| 中文描述： | AHC/VHC SERIES, 2-INPUT NAND GATE, PDSO5 |
| 封装： | LEAD FREE, SC-70, SC-88A, SOT-353, 5 PIN |
| 文件页数： | 2/6页 |
| 文件大小： | 78K |
| 代理商： | MC74VHC1G01DFT1G |
MC74VHC1G01
http://onsemi.com
2
MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
V
CC
V
IN
V
OUT
I
IK
I
OK
I
OUT
I
CC
T
STG
T
L
T
J
DC Supply Voltage
0.5 to
7.0
V
DC Input Voltage
0.5 to +7.0
V
DC Output Voltage
0.5 to V
CC
20
0.5
V
DC Input Diode Current
mA
DC Output Diode Current
V
OUT
GND; V
OUT
V
CC
20
mA
DC Output Sink Current, per Pin
25
mA
DC Supply Current, V
CC
and GND Pin
Storage Temperature Range
25
mA
65 to
150
°
C
°
C
°
C
Lead Temperature, 1 mm from Case for 10 Seconds
260
Junction Temperature Under Bias
150
JA
Thermal Resistance
SC705/SC88A (Note 1)
TSOP5
350
230
°
C/W
P
D
Power Dissipation in Still Air at 85
°
C
SC705/SC88A
TSOP5
150
200
mW
MSL
Moisture Sensitivity
Level 1
F
R
V
ESD
Flammability Rating
Oxygen Index: 28 to 34
UL 94 V0 @ 0.125 in
ESD Withstand Voltage
Human Body Model (Note 2)
Machine Model (Note 3)
Charged Device Model (Note 4)
2000
200
N/A
V
I
LATCHUP
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
1. Measured with minimum pad spacing on an FR4 board, using 10 mmby1 inch, 2ounce copper trace with no air flow.
2. Tested to EIA/JESD22A114A.
3. Tested to EIA/JESD22A115A.
4. Tested to JESD22C101A.
5. Tested to EIA/JESD78.
Latchup Performance
Above V
CC
and Below GND at 125
°
C (Note 5)
500
mA
RECOMMENDED OPERATING CONDITIONS
Symbol
Characteristics
Min
Max
Unit
V
CC
DC Supply Voltage
2.0
5.5
V
V
IN
DC Input Voltage
0.0
5.5
V
V
OUT
DC Output Voltage
0.0
7.0
V
T
A
Operating Temperature Range
55
+125
°
C
t
r
, t
f
Input Rise and Fall Time
V
CC
= 3.3 V
±
0.3 V
V
CC
= 5.0 V
±
0.5 V
0
0
100
20
ns/V
DEVICE JUNCTION TEMPERATURE VERSUS
TIME TO 0.1% BOND FAILURES
Junction
Temperature
°
C
Time, Hours
Time, Years
80
1,032,200
117.8
90
419,300
47.9
100
178,700
20.4
110
79,600
9.4
120
37,000
4.2
130
17,800
2.0
140
8,900
1.0
1
1
10
100
1000
FAILURE RATE OF PLASTIC = CERAMIC
UNTIL INTERMETALLICS OCCUR
Figure 3. Failure Rate vs. Time Junction Temperature
N
TIME, YEARS
T
J
°
C
T
J
°
C
T
J
°
C
T
J
°
C
T
J
°
C
T
J
°
C
相关PDF资料 |
PDF描述 |
|---|---|
| MC74VHC1G01DTT1 | 2-Input NAND Gate with Open Drain Output |
| MC74VHC1G01DTT1G | 2-Input NAND Gate with Open Drain Output |
| MC74VHC1G01DFT2 | 2-Input NAND Gate with Open Drain Output |
| MC74VHC1G01DFT2G | 2-Input NAND Gate with Open Drain Output |
| MC74VHC1G125 | Noninverting 3-State Buffer |
相关代理商/技术参数 |
参数描述 |
|---|---|
| MC74VHC1G01DFT2 | 功能描述:逻辑门 2-5.5V Single NAND RoHS:否 制造商:Texas Instruments 产品:OR 逻辑系列:LVC 栅极数量:2 线路数量（输入/输出）:2 / 1 高电平输出电流:- 16 mA 低电平输出电流:16 mA 传播延迟时间:3.8 ns 电源电压-最大:5.5 V 电源电压-最小:1.65 V 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:DCU-8 封装:Reel |
| MC74VHC1G01DFT2G | 功能描述:逻辑门 2-5.5V Single NAND 2-Input w/Open Drain RoHS:否 制造商:Texas Instruments 产品:OR 逻辑系列:LVC 栅极数量:2 线路数量（输入/输出）:2 / 1 高电平输出电流:- 16 mA 低电平输出电流:16 mA 传播延迟时间:3.8 ns 电源电压-最大:5.5 V 电源电压-最小:1.65 V 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:DCU-8 封装:Reel |
| MC74VHC1G01DTT1 | 功能描述:逻辑门 2-5.5V Single NAND RoHS:否 制造商:Texas Instruments 产品:OR 逻辑系列:LVC 栅极数量:2 线路数量（输入/输出）:2 / 1 高电平输出电流:- 16 mA 低电平输出电流:16 mA 传播延迟时间:3.8 ns 电源电压-最大:5.5 V 电源电压-最小:1.65 V 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:DCU-8 封装:Reel |
| MC74VHC1G01DTT1G | 功能描述:逻辑门 2-5.5V Single NAND 2-Input w/Open Drain RoHS:否 制造商:Texas Instruments 产品:OR 逻辑系列:LVC 栅极数量:2 线路数量（输入/输出）:2 / 1 高电平输出电流:- 16 mA 低电平输出电流:16 mA 传播延迟时间:3.8 ns 电源电压-最大:5.5 V 电源电压-最小:1.65 V 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:DCU-8 封装:Reel |
| MC74VHC1G02DFT1 | 功能描述:逻辑门 2-5.5V Single NOR RoHS:否 制造商:Texas Instruments 产品:OR 逻辑系列:LVC 栅极数量:2 线路数量（输入/输出）:2 / 1 高电平输出电流:- 16 mA 低电平输出电流:16 mA 传播延迟时间:3.8 ns 电源电压-最大:5.5 V 电源电压-最小:1.65 V 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:DCU-8 封装:Reel |
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