参数资料
型号: MC8640THX1250HC
厂商: Freescale Semiconductor
文件页数: 117/130页
文件大小: 0K
描述: MPU DUAL E600 994-FCCBGA
标准包装: 1
系列: MPC86xx
处理器类型: 32-位 MPC86xx PowerPC
速度: 1.25GHz
电压: 1.05V
安装类型: 表面贴装
封装/外壳: 994-BCBGA,FCCBGA
供应商设备封装: 994-FCCBGA(33x33)
包装: 托盘
MPC8640 and MPC8640D Integrated Host Processor Hardware Specifications, Rev. 3
Freescale Semiconductor
87
Package
Random jitter is calibrated using a high pass filter with a low frequency corner at 20 MHz and a 20
dB/decade roll-off below this. The required sinusoidal jitter specified in Section 15.7, “Receiver
Specifications,is then added to the signal and the test load is replaced by the receiver being tested.
16 Package
This section details package parameters and dimensions.
16.1
Package Parameters for the MPC8640
The package parameters are as provided in the following list. The package type is 33 mm
× 33 mm, 1023
pins. There are two package options: high-lead flip chip-ceramic ball grid array (FC-CBGA) and lead-free
(FC-CBGA).
For all package types:
Die size
12.1 mm
× 14.7 mm
Package outline
33 mm
× 33 mm
Interconnects
1023
Pitch
1 mm
Total Capacitor count
43 caps; 100 nF each
For high-lead FC-CBGA (package option: HCTE1 HX)
Maximum module height
2.97 mm
Minimum module height
2.47 mm
Solder Balls
89.5% Pb 10.5% Sn
Ball diameter (typical2)
0.60 mm
For RoHS lead-free FC-CBGA (package option: HCTE1 VU)
Maximum module height
2.77 mm
Minimum module height
2.27 mm
Solder Balls
95.5% Sn 4.0% Ag 0.5% Cu
Ball diameter (typical2)
0.60 mm
1 High-coefficient of thermal expansion
2 Typical ball diameter is before reflow
相关PDF资料
PDF描述
345-012-541-202 CARDEDGE 12POS DUAL .100 GREEN
MC8640THX1067NC MPU DUAL E600 994-FCCBGA
345-012-541-201 CARDEDGE 12POS DUAL .100 GREEN
MC8640THX1000NC MPU DUAL E600 994-FCCBGA
345-012-540-804 CARDEDGE 12POS DUAL .100 GREEN
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