参数资料
型号: MC8641VU1000HE
厂商: FREESCALE SEMICONDUCTOR INC
元件分类: 微控制器/微处理器
英文描述: 32-BIT, 166.66 MHz, MICROPROCESSOR, CBGA1023
封装: 33 X 33 MM, ROHS COMPLIANT, CERAMIC, BGA-1023
文件页数: 16/130页
文件大小: 1493K
代理商: MC8641VU1000HE
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 2
112
Freescale Semiconductor
Thermal
19.2.2
Thermal Interface Materials
A thermal interface material is recommended at the package-to-heat sink interface to minimize the thermal
contact resistance. Figure 61 shows the thermal performance of three thin-sheet thermal-interface
materials (silicone, graphite/oil, floroether oil), a bare joint, and a joint with thermal grease as a function
of contact pressure. As shown, the performance of these thermal interface materials improves with
increasing contact pressure. The use of thermal grease significantly reduces the interface thermal
resistance. That is, the bare joint results in a thermal resistance approximately seven times greater than the
thermal grease joint.
Often, heat sinks are attached to the package by means of a spring clip to holes in the printed-circuit board
(see Figure 59). Therefore, synthetic grease offers the best thermal performance, considering the low
interface pressure, and is recommended due to the high power dissipation of the MPC8641. Of course, the
selection of any thermal interface material depends on many factors—thermal performance requirements,
manufacturability, service temperature, dielectric properties, cost, and so on.
Figure 61. Thermal Performance of Select Thermal Interface Material
The board designer can choose between several types of thermal interface. Heat sink adhesive materials
should be selected based on high conductivity and mechanical strength to meet equipment shock/vibration
requirements. There are several commercially available thermal interfaces and adhesive materials
provided by the following vendors:
0
0.5
1
1.5
2
0
1020
30
40
50607080
Silicone Sheet (0.006 in.)
Bare Joint
Fluoroether Oil Sheet (0.007 in.)
Graphite/Oil Sheet (0.005 in.)
Synthetic Grease
Contact Pressure (psi)
Spec
if
ic
Ther
m
a
lResi
st
ance
(K
-i
n.
2
/W
)
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相关代理商/技术参数
参数描述
MC8641VU1000J 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:Integrated Host Processor Hardware Specifications
MC8641VU1000K 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:Integrated Host Processor Hardware Specifications
MC8641VU1000N 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:Integrated Host Processor Hardware Specifications
MC8641VU1000NB 功能描述:微处理器 - MPU G8 REV 2.0 0.95V 105C RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
MC8641VU1000NC 功能描述:微处理器 - MPU G8 REV 2.1 0.95V 105C RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324