参数资料
型号: MC9328MX1DVH20
厂商: FREESCALE SEMICONDUCTOR INC
元件分类: 微控制器/微处理器
英文描述: 200 MHz, RISC PROCESSOR, PBGA256
封装: 14 X 14 MM, 1.30 MM HEIGHT, 0.80 MM PITCH, MAPBGA-256
文件页数: 6/96页
文件大小: 1486K
代理商: MC9328MX1DVH20
MC9328MX1 Advance Information, Rev. 4.1
14
Freescale Semiconductor
Specifications
3 Specifications
This section contains the electrical specifications and timing diagrams for the MC9328MX1 processor.
3.1 Maximum Ratings
Table 4 provides information on maximum ratings which are those values beyond which damage to the device may
occur. Functional operation should be restricted to the limits listed in Recommended Operating Range Table 5 on
page 15 or the DC Characteristics table.
Table 4. Maximum Ratings1
1.
Voltages referenced to Vss and BTRFGND, which are both tied to the same potential.
Symbol
Rating
Minimum
Maximum
Unit
NVdd
DC I/O Supply Voltage
V
QVdd
DC Internal (core) Supply Voltage
V
AVdd
DC Analog Supply Voltage
V
BTRFVdd
DC Bluetooth Supply Voltage
V
Vdd
Supply voltage
-0.3
3.3
V
TA
Maximum operating temperature range
MC9328MX1VH20/MC9328MX1VM20
070
°C
TA
Maximum operating temperature range
MC9328MX1DVH20/MC9328MX1DVM20
-30
70
°C
TA
Maximum operating temperature range
MC9328MX1CVH15/MC9328MX1CVM15
-40
85
°C
VESD_HBM
ESD at human body model (HBM)
2000
V
VESD_MM
ESD at machine model (MM)
100
V
ILatchup
Latch-up current
200
mA
Test
Storage temperature
-55
150
°C
Pmax
Power Consumption
8002
2.
A typical application with 30 pads simultaneously switching assumes the GPIO toggling and instruction fetches from
the ARM core-that is, 7x GPIO, 15x Data bus, and 8x Address bus.
13003
3.
A worst-case application with 70 pads simultaneously switching assumes the GPIO toggling and instruction fetches
from the ARM core-that is, 32x GPIO, 30x Data bus, 8x Address bus. These calculations are based on the core
running its heaviest OS application at 200MHz, and where the whole image is running out of SDRAM. QVDD at
2.0V, NVDD and AVDD at 3.3V, therefore, 180mA is the worst measurement recorded in the factory environment,
max 5mA is consumed for OSC pads, with each toggle GPIO consuming 4mA.
mW
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MC9328MX1DVH20R2 制造商:Rochester Electronics LLC 功能描述:- Bulk 制造商:Motorola Inc 功能描述:
MC9328MX1DVM15 功能描述:处理器 - 专门应用 DRAGONBALL MX1 RoHS:否 制造商:Freescale Semiconductor 类型:Multimedia Applications 核心:ARM Cortex A9 处理器系列:i.MX6 数据总线宽度:32 bit 最大时钟频率:1 GHz 指令/数据缓存: 数据 RAM 大小:128 KB 数据 ROM 大小: 工作电源电压: 最大工作温度:+ 95 C 安装风格:SMD/SMT 封装 / 箱体:MAPBGA-432
MC9328MX1DVM15R2 功能描述:处理器 - 专门应用 DRAGONBALL MX1 RoHS:否 制造商:Freescale Semiconductor 类型:Multimedia Applications 核心:ARM Cortex A9 处理器系列:i.MX6 数据总线宽度:32 bit 最大时钟频率:1 GHz 指令/数据缓存: 数据 RAM 大小:128 KB 数据 ROM 大小: 工作电源电压: 最大工作温度:+ 95 C 安装风格:SMD/SMT 封装 / 箱体:MAPBGA-432
MC9328MX1DVM20 功能描述:处理器 - 专门应用 DRAGONBALL MX1 RoHS:否 制造商:Freescale Semiconductor 类型:Multimedia Applications 核心:ARM Cortex A9 处理器系列:i.MX6 数据总线宽度:32 bit 最大时钟频率:1 GHz 指令/数据缓存: 数据 RAM 大小:128 KB 数据 ROM 大小: 工作电源电压: 最大工作温度:+ 95 C 安装风格:SMD/SMT 封装 / 箱体:MAPBGA-432
MC9328MX1DVM20R2 功能描述:处理器 - 专门应用 DRAGONBALL MX1 RoHS:否 制造商:Freescale Semiconductor 类型:Multimedia Applications 核心:ARM Cortex A9 处理器系列:i.MX6 数据总线宽度:32 bit 最大时钟频率:1 GHz 指令/数据缓存: 数据 RAM 大小:128 KB 数据 ROM 大小: 工作电源电压: 最大工作温度:+ 95 C 安装风格:SMD/SMT 封装 / 箱体:MAPBGA-432