参数资料
型号: MC9328MXLVF20R2
厂商: FREESCALE SEMICONDUCTOR INC
元件分类: 微控制器/微处理器
英文描述: 200 MHz, RISC PROCESSOR, PBGA225
封装: 13 X 13 MM, 0.80 MM PITCH, PLASTIC, BGA-225
文件页数: 3/84页
文件大小: 1448K
代理商: MC9328MXLVF20R2
Specifications
MC9328MXL Advance Information, Rev. 5.1
Freescale Semiconductor
11
3 Specifications
This section contains the electrical specifications and timing diagrams for the MC9328MXL processor.
3.1 Maximum Ratings
Table 4 provides information on maximum ratings.
Substrate Supply Pins
SVDD
Supply routed through substrate of package; not to be bonded
SGND
Ground routed through substrate of package; not to be bonded
Table 4. Maximum Ratings
Rating
Symbol
Minimum
Maximum
Unit
Supply voltage
Vdd
-0.3
3.3
V
Maximum operating temperature range
MC9328MXLVH20/MC9328MXLVM20/
MC9328MXLVF20/MC9328MXLVP20
TA
070
°C
Maximum operating temperature range
MC9328MXLDVH20/MC9328MXLDVM20/
MC9328MXLDVF20/MC9328MXLDVP20
TA
-30
70
°C
Maximum operating temperature range
MC9328MXLCVH15/MC9328MXLCVM15/
MC9328MXLCVF15/MC9328MXLCVP15
TA
-40
85
°C
ESD at human body model (HBM)
VESD_HBM
2000
V
ESD at machine model (MM)
VESD_MM
100
V
Latch-up current
ILatchup
200
mA
Storage temperature
Test
-55
150
°C
Power Consumption
Pmax
8001
1.
A typical application with 30 pads simultaneously switching assumes the GPIO toggling and instruction fetches from
the ARM core-that is, 7x GPIO, 15x Data bus, and 8x Address bus.
13002
2.
A worst-case application with 70 pads simultaneously switching assumes the GPIO toggling and instruction fetches
from the ARM core-that is, 32x GPIO, 30x Data bus, 8x Address bus. These calculations are based on the core
running its heaviest OS application at 200MHz, and where the whole image is running out of SDRAM. QVDD at
2.0V, NVDD and AVDD at 3.3V, therefore, 180mA is the worst measurement recorded in the factory environment,
max 5mA is consumed for OSC pads, with each toggle GPIO consuming 4mA.
mW
Table 3. MC9328MXL Signal Descriptions (Continued)
Signal Name
Function/Notes
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相关代理商/技术参数
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