参数资料
型号: MC9RS08KB12CWJ
厂商: Freescale Semiconductor
文件页数: 36/37页
文件大小: 0K
描述: MCU 8-BIT 12K FLASH 20-SOIC
标准包装: 38
系列: RS08
核心处理器: RS08
芯体尺寸: 8-位
速度: 20MHz
连通性: I²C,SPI
外围设备: LVD,POR,PWM,WDT
输入/输出数: 18
程序存储器容量: 12KB(12K x 8)
程序存储器类型: 闪存
RAM 容量: 254 x 8
电压 - 电源 (Vcc/Vdd): 1.8 V ~ 5.5 V
数据转换器: A/D 12x10b
振荡器型: 内部
工作温度: -40°C ~ 85°C
封装/外壳: 20-SOIC(0.295",7.50mm 宽)
包装: 管件
MC9RS08KB12 Series MCU Data Sheet, Rev. 5
Electrical Characteristics
Freescale Semiconductor
8
unusually high pin current (heavy loads), the difference between pin voltage and VSS or VDD will be very
small.
The average chip-junction temperature (TJ) in
°C can be obtained from:
TJ = TA + (PD × θJA)
Eqn. 1
where:
TA = Ambient temperature, °C
θJA = Package thermal resistance, junction-to-ambient, °C /W
PD = Pint + PI/O
Pint = IDD × VDD, Watts chip internal power
PI/O = Power dissipation on input and output pins user determined
For most applications, PI/O << Pint and can be neglected. An approximate relationship between PD and TJ
(if PI/O is neglected) is:
PD = K ÷ (TJ + 273°C)
Eqn. 2
Solving Equation 1 and Equation 2 for K gives:
K = PD × (TA + 273°C) + θJA× (PD)
2
Eqn. 3
where K is a constant pertaining to the particular part. K can be determined from Equation 3 by measuring
PD (at equilibrium) for a known TA. Using this value of K, the values of PD and TJ can be obtained by
solving Equation 1 and Equation 2 iteratively for any value of TA.
3.5
ESD Protection and Latch-Up Immunity
Although damage from electrostatic discharge (ESD) is much less common on these devices than on early
CMOS circuits, normal handling precautions must be used to avoid exposure to static discharge.
Qualification tests are performed to ensure that these devices can withstand exposure to reasonable levels
of static without suffering any permanent damage.
Table 4. Thermal Characteristics
Rating
Symbol
Value
Unit
Operating temperature range (packaged)
TA
TL to TH
–40 to 85
°C
Maximum junction temperature
TJMAX
150
°C
Thermal resistance 24-pin QFN
θ
JA
113
°C/W
Thermal resistance 20-pin SOIC
θ
JA
83
°C/W
Thermal resistance 16-pin SOIC NB
θ
JA
103
°C/W
Thermal resistance 16-pin TSSOP
θ
JA
29
°C/W
Thermal resistance 8-pin SOIC
θ
JA
150
°C/W
Thermal resistance 8-pin DFN
θ
JA
110
°C/W
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