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参数资料
| 型号： | MC9S08FL16CBM |
| 厂商： | FREESCALE SEMICONDUCTOR INC |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 8-BIT, FLASH, 20 MHz, MICROCONTROLLER, PDIP32 |
| 封装： | ROHS COMPLIANT, PLASTIC, SDIP-32 |
| 文件页数： | 3/34页 |
| 文件大小： | 464K |
| 代理商： | MC9S08FL16CBM |
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Electrical Characteristics
MC9S08FL16 Series Data Sheet, Rev. 3
Freescale Semiconductor
11
TJ = TA + (PD JA)
Eqn. 1
where:
TA = Ambient temperature, C
JA = Package thermal resistance, junction-to-ambient, C/W
PD = Pint PI/O
Pint = IDD VDD, Watts — chip internal power
PI/O = Power dissipation on input and output pins — user determined
For most applications, PI/O far much smaller than Pint and can be neglected. An approximate relationship
between PD and TJ (if PI/O is neglected) is:
PD = K (TJ + 273 C)
Eqn. 2
Solving Equation 1 and Equation 2 for K gives:
K = PD (TA + 273 C) + JA (PD)
2
Eqn. 3
where K is a constant pertaining to the particular part. K can be determined from Equation 3 by measuring
PD (at equilibrium) for an known TA. Using this value of K, the values of PD and TJ can be obtained by
5.5
ESD Protection and Latch-Up Immunity
Although damage from electrostatic discharge (ESD) is much less common on these devices than on early
CMOS circuits, normal handling precautions must be taken to avoid exposure to static discharge.
Qualification tests are performed to ensure that these devices can withstand exposure to reasonable levels
of static without suffering any permanent damage.
During the device qualification, ESD stresses were performed for the human body model (HBM) and the
charge device model (CDM).
A device is defined as a failure if after exposure to ESD pulses the device no longer meets the device
specification. Complete DC parametric and functional testing is performed per the applicable device
specification at room temperature followed by hot temperature, unless instructed otherwise in the device
specification.
Table 5. ESD and Latch-Up Test Conditions
Model
Description
Symbol
Value
Unit
Human
body
Series resistance
R1
1500
Storage capacitance
C
100
pF
Number of pulses per pin
—
3
—
Latch-up
Minimum input voltage limit
—
–2.5
V
Maximum input voltage limit
—
7.5
V
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MC9S08FL16CLC | 功能描述:8位微控制器 -MCU S08 16K FLASH FL16 RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT |
| MC9S08FL8 | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:8-Bit S08 Central Processor Unit (CPU) |
| MC9S08FL8CBM | 功能描述:8位微控制器 -MCU S08 8K FLASH FL8 RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT |
| MC9S08FL8CLC | 功能描述:8位微控制器 -MCU S08 8K FLASH FL8 RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT |
| MC9S08GB32 | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:Microcontrollers |
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