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参数资料
| 型号： | MC9S08QA4CPAE |
| 厂商： | FREESCALE SEMICONDUCTOR INC |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | MICROCONTROLLER, PDIP8 |
| 封装： | ROHS COMPLIANT, PLASTIC, DIP-8 |
| 文件页数： | 29/32页 |
| 文件大小： | 2368K |
| 代理商： | MC9S08QA4CPAE |
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MC9S08QA4 Series MCU Data Sheet, Rev. 3
Electrical Characteristics
Freescale Semiconductor
6
The average chip-junction temperature (TJ) in °C can be obtained from:
TJ = TA + (PD × θJA)
Eqn. 1
where:
—TA = Ambient temperature, °C
—
θJA = Package thermal resistance, junction-to-ambient, °C/W
—PD = Pint + PI/O
—Pint = IDD × VDD, Watts — chip internal power
—PI/O = Power dissipation on input and output pins — user-determined
For most applications, PI/O << Pint and can be neglected. An approximate relationship between PD and TJ (if PI/O is neglected)
is:
PD = K ÷ (TJ + 273°C)
Eqn. 2
Solving Equation 1 and Equation 2 for K gives:
K = PD × (TA + 273°C) + θJA × (PD)
2
Eqn. 3
where K is a constant pertaining to the particular part. K can be determined from Equation 3 by measuring PD (at equilibrium)
for a known TA. Using this value of K, the values of PD and TJ can be obtained by solving Equation 1 and Equation 2 iteratively
for any value of TA.
3.4
ESD Protection and Latch-Up Immunity
Although damage from electrostatic discharge (ESD) is much less common on these devices than on early CMOS circuits,
normal handling precautions should be used to avoid exposure to static discharge. Qualification tests are performed to ensure
that these devices can withstand exposure to reasonable levels of static without suffering any permanent damage.
All ESD testing is in conformity with AEC-Q100 Stress Test Qualification for Automotive Grade Integrated Circuits. During
the device qualification ESD stresses were performed for the human body model (HBM), the machine model (MM) and the
charge device model (CDM).
Table 3. Thermal Characteristics
Rating
Symbol
Value
Unit
Operating temperature range
(packaged)
TA
TL to TH
–40 to 85
°C
Thermal resistance
Single-layer board
8-pin PDIP
θ
JA
113
°C/W
8-pin NB SOIC
150
8-pin DFN
179
Thermal resistance
Four-layer board
8-pin PDIP
θ
JA
72
°C/W
8-pin NB SOIC
87
8-pin DFN
41
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相关代理商/技术参数 |
参数描述 |
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| MC9S08QB4CGK | 功能描述:8位微控制器 -MCU S08 4K FLASH QB4 QFN24 RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT |
| MC9S08QB4CGK | 制造商:Freescale Semiconductor 功能描述:IC 8BIT MCU HCS08 20MHZ QFN-24 |
| MC9S08QB4CTG | 功能描述:8位微控制器 -MCU S08 4K FLASH QB4 TSSOP16 RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT |
| MC9S08QB4CWL | 功能描述:8位微控制器 -MCU S08 4K FLASH QB4 SOIC28 RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT |
| MC9S08QB4CWL | 制造商:Freescale Semiconductor 功能描述:IC 8BIT MCU HCS08 20MHZ WSOIC-28 |
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