参数资料
型号: MC9S12DG128EMFU
厂商: FREESCALE SEMICONDUCTOR INC
元件分类: 微控制器/微处理器
英文描述: 16-BIT, FLASH, 25 MHz, MICROCONTROLLER, PQFP80
封装: PLASTIC, LQFP-80
文件页数: 130/142页
文件大小: 6464K
代理商: MC9S12DG128EMFU
Device User Guide — 9S12DT128DGV2/D V02.15
88
Freescale Semiconductor
15.1 Device-specific information
The read-only Module Version Register (BFMVR) contains the current version number of $80.
Section 16 Pulse Width Modulator (PWM) Block
Description
Consult the PWM_8B8C Block User Guide for information about the Pulse Width Modulator module.
When the PWM_8B8C Block User Guide refers to freeze mode this is equivalent to active BDM mode.
Section 17 Flash EEPROM 128K Block Description
Consult the FTS128K Block User Guide for information about the flash module.
The "S12 LRAE" is a generic Load RAM and Execute (LRAE) program which will be programmed into
the flash memory of this device during manufacture. This LRAE program will provide greater
programming flexibility to the end users by allowing the device to be programmed directly using CAN or
SCI after it is assembled on the PCB. Use of the LRAE program is at the discretion of the end user and, if
not required, it must simply be erased prior to flash programming. For more details of the S12 LRAE and
its implementation, please see the S12 LREA Application Note (AN2546/D).
It is planned that most HC9S12 devices manufactured after Q1 of 2004 will be shipped with the S12 LRAE
programmed in the Flash . Exact details of the changeover (ie blank to programmed) for each product will
be communicated in advance via GPCN and will be traceable by the customer via datecode marking on
the device.
Please contact Freescale Sales if you have any additional questions.
Section 18 EEPROM 2K Block Description
Consult the EETS2K Block User Guide for information about the EEPROM module.
Section 19 RAM Block Description
This module supports single-cycle misaligned word accesses without wait states.
Section 20 MSCAN Block Description
There are three MSCAN modules (CAN4, CAN1 and CAN0) implemented on the MC9S12DT128.
Consult the MSCAN Block User Guide for information about the Motorola Scalable CAN Module.
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相关代理商/技术参数
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MC9S12DG128MPV 功能描述:IC MCU 128K FLASH 25MHZ 112-LQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - 微控制器, 系列:HCS12 标准包装:250 系列:56F8xxx 核心处理器:56800E 芯体尺寸:16-位 速度:60MHz 连通性:CAN,SCI,SPI 外围设备:POR,PWM,温度传感器,WDT 输入/输出数:21 程序存储器容量:40KB(20K x 16) 程序存储器类型:闪存 EEPROM 大小:- RAM 容量:6K x 16 电压 - 电源 (Vcc/Vdd):2.25 V ~ 3.6 V 数据转换器:A/D 6x12b 振荡器型:内部 工作温度:-40°C ~ 125°C 封装/外壳:48-LQFP 包装:托盘 配用:MC56F8323EVME-ND - BOARD EVALUATION MC56F8323
MC9S12DG128MPVE 功能描述:16位微控制器 - MCU 128K FLASH HCS12 MCU RoHS:否 制造商:Texas Instruments 核心:RISC 处理器系列:MSP430FR572x 数据总线宽度:16 bit 最大时钟频率:24 MHz 程序存储器大小:8 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:2 V to 3.6 V 工作温度范围:- 40 C to + 85 C 封装 / 箱体:VQFN-40 安装风格:SMD/SMT
MC9S12DG128MPVE 制造商:Freescale Semiconductor 功能描述:MICROCONTROLLER
MC9S12DG128MPVER 功能描述:IC MCU 128K FLASH 112-LQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - 微控制器, 系列:HCS12 标准包装:1 系列:87C 核心处理器:MCS 51 芯体尺寸:8-位 速度:16MHz 连通性:SIO 外围设备:- 输入/输出数:32 程序存储器容量:8KB(8K x 8) 程序存储器类型:OTP EEPROM 大小:- RAM 容量:256 x 8 电压 - 电源 (Vcc/Vdd):4 V ~ 6 V 数据转换器:- 振荡器型:外部 工作温度:0°C ~ 70°C 封装/外壳:44-DIP 包装:管件 其它名称:864285