收藏本站
参数资料
型号： MC9S12DT256CVPV
厂商： FREESCALE SEMICONDUCTOR INC
元件分类： 微控制器/微处理器
英文描述： 16-BIT, FLASH, 25 MHz, MICROCONTROLLER, PQFP112
封装： LQFP-112
文件页数： 96/126页
文件大小： 3405K
代理商： MC9S12DT256CVPV
MC9S12DP256B Device User Guide — V02.15
73
Section 4 Modes of Operation
4.1 Overview
Eight possible modes determine the operating configuration of the MC9S12DP256B. Each mode has an
associated default memory map and external bus configuration controlled by a further pin.
Three low power modes exist for the device.
4.2 Chip Configuration Summary
The operating mode out of reset is determined by the states of the MODC, MODB, and MODA pins during
reset (Table 4-1). The MODC, MODB, and MODA bits in the MODE register show the current operating
mode and provide limited mode switching during operation. The states of the MODC, MODB, and MODA
pins are latched into these bits on the rising edge of the reset signal. The ROMCTL signal allows the setting
of the ROMON bit in the MISC register thus controlling whether the internal Flash is visible in the
memory map. ROMON = 1 mean the Flash is visible in the memory map. The state of the ROMCTL pin
is latched into the ROMON bit in the MISC register on the rising edge of the reset signal.
For further explanation on the modes refer to the Core User Guide.
Table 4-1 Mode Selection
BKGD =
MODC
PE6 =
MODB
PE5 =
MODA
PK7 =
ROMCTL
ROMON
Bit
Mode Description
000
X
1
Special Single Chip, BDM allowed and ACTIVE. BDM is
allowed in all other modes but a serial command is
required to make BDM active.
001
X
0
Emulation Expanded Narrow, BDM allowed
010
X
0
Special Test (Expanded Wide), BDM allowed
011
X
0
Emulation Expanded Wide, BDM allowed
100
X
1
Normal Single Chip, BDM allowed
101
00
Normal Expanded Narrow, BDM allowed
11
110
X
1
Peripheral; BDM allowed but bus operations would cause
bus conicts (must not be used)
111
00
Normal Expanded Wide, BDM allowed
11
Table 4-2 Clock Selection Based on PE7
PE7 = XCLKS
Description
1
Colpitts Oscillator selected
0
External clock selected
F
re
e
sc
a
le
S
e
m
ic
o
n
d
u
c
to
r,
I
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
n
c
..
.
相关PDF资料
PDF描述
MPC8343ECZQADDX 32-BIT, 266 MHz, MICROPROCESSOR, PBGA620
MC7447AVS1333LB 32-BIT, 1333 MHz, RISC PROCESSOR, CBGA360
MPC8250ACVVIFBX 32-BIT, 200 MHz, RISC PROCESSOR, PBGA480
MPC8250AZQPIBX 32-BIT, 300 MHz, RISC PROCESSOR, PBGA516
MC56F8322VFA60R2 0-BIT, 120 MHz, OTHER DSP, PQFP48
相关代理商/技术参数
参数描述
MC9S12DT256MFUE 功能描述:16位微控制器 - MCU BARRACUDA4 MOS13 EPP RoHS:否 制造商:Texas Instruments 核心:RISC 处理器系列:MSP430FR572x 数据总线宽度:16 bit 最大时钟频率:24 MHz 程序存储器大小:8 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:2 V to 3.6 V 工作温度范围:- 40 C to + 85 C 封装 / 箱体:VQFN-40 安装风格:SMD/SMT
MC9S12DT256MPVE 功能描述:16位微控制器 - MCU BARRACUDA4 MOS13 L01Y RoHS:否 制造商:Texas Instruments 核心:RISC 处理器系列:MSP430FR572x 数据总线宽度:16 bit 最大时钟频率:24 MHz 程序存储器大小:8 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:2 V to 3.6 V 工作温度范围:- 40 C to + 85 C 封装 / 箱体:VQFN-40 安装风格:SMD/SMT
MC9S12DT256VFUE 功能描述:16位微控制器 - MCU BARRACUDA4 MOS13 EPP RoHS:否 制造商:Texas Instruments 核心:RISC 处理器系列:MSP430FR572x 数据总线宽度:16 bit 最大时钟频率:24 MHz 程序存储器大小:8 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:2 V to 3.6 V 工作温度范围:- 40 C to + 85 C 封装 / 箱体:VQFN-40 安装风格:SMD/SMT
MC9S12DT256VPVE 功能描述:16位微控制器 - MCU BARRACUDA4 MOS13 L01Y RoHS:否 制造商:Texas Instruments 核心:RISC 处理器系列:MSP430FR572x 数据总线宽度:16 bit 最大时钟频率:24 MHz 程序存储器大小:8 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:2 V to 3.6 V 工作温度范围:- 40 C to + 85 C 封装 / 箱体:VQFN-40 安装风格:SMD/SMT
MC9S12DT512CPVE 制造商:Freescale Semiconductor 功能描述:16-BIT HCS12 CISC 512KB FLASH 2.5V/5V 112-PIN LQFP BRICK - Bulk
发布紧急采购，3分钟左右您将得到回复。

采购需求

(若只采购一条型号，填写一行即可)

发布成功！您可以继续发布采购。也可以进入我的后台，查看报价

发布成功！您可以继续发布采购。也可以进入我的后台，查看报价

*型号 *数量 厂商 批号 封装
添加更多采购

我的联系方式

*
*
*