参数资料
型号: MC9S12DT256VPV
厂商: FREESCALE SEMICONDUCTOR INC
元件分类: 微控制器/微处理器
英文描述: 16-BIT, FLASH, 25 MHz, MICROCONTROLLER, PQFP112
封装: LQFP-112
文件页数: 113/132页
文件大小: 782K
代理商: MC9S12DT256VPV
MC9S12DT256 Device User Guide — V03.07
81
There are two Serial Communications Interfaces (SCI1 and SCI0) implemented on the MC9S12DT256
device. Consult the SCI Block User Guide for information about each Serial Communications Interface
module.
Section 12 Serial Peripheral Interface (SPI) Block
Description
There are three Serial Peripheral Interfaces(SPI2, SPI1 and SPI0) implemented on MC9S12DT256.
Consult the SPI Block User Guide for information about each Serial Peripheral Interface module.
Section 13 J1850 (BDLC) Block Description
Consult the BDLC Block User Guide for information about the J1850 module.
Section 14 Pulse Width Modulator (PWM) Block
Description
Consult the PWM_8B8C Block User Guide for information about the Pulse Width Modulator module.
When the PWM _8B8CBlock Guide refers to freeze mode this is equivalent to active BDM mode
Section 15 Flash EEPROM 256K Block Description
The "S12 LRAE" is a generic Load RAM and Execute (LRAE) program which will be programmed into
the flash memory of this device during manufacture. This LRAE program will provide greater
programming flexibility to the end users by allowing the device to be programmed directly using CAN or
SCI after it is assembled on the PCB. Use of the LRAE program is at the discretion of the end user and, if
not required, it must simply be erased prior to flash programming. For more details of the S12 LRAE and
its implementation, please see the S12 LREA Application Note (AN2546/D).
It is planned that most HC9S12 devices manufactured after Q1 of 2004 will be shipped with the S12 LRAE
programmed in the Flash. Exact details of the changeover (i.e. blank to programmed) for each product will
be communicated in advance via GPCN and will be traceable by the customer via datecode marking on
the device.
Please contact Motorola SPS Sales if you have any additional questions.
Consult the FTS256K Block User Guide for information about the flash module.
Section 16 EEPROM 4K Block Description
相关PDF资料
PDF描述
MC68HC16Z1MFC16 16-BIT, 16.78 MHz, MICROCONTROLLER, PQFP132
MC9S12A128CPV 16-BIT, FLASH, 25 MHz, MICROCONTROLLER, PQFP112
MPC7410THX400LE 32-BIT, 400 MHz, RISC PROCESSOR, CBGA360
MPC7410TRX400LE 32-BIT, 400 MHz, RISC PROCESSOR, CBGA360
MPC7410TRX400NE 32-BIT, 400 MHz, RISC PROCESSOR, CBGA360
相关代理商/技术参数
参数描述
MC9S12DT256VPVE 功能描述:16位微控制器 - MCU BARRACUDA4 MOS13 L01Y RoHS:否 制造商:Texas Instruments 核心:RISC 处理器系列:MSP430FR572x 数据总线宽度:16 bit 最大时钟频率:24 MHz 程序存储器大小:8 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:2 V to 3.6 V 工作温度范围:- 40 C to + 85 C 封装 / 箱体:VQFN-40 安装风格:SMD/SMT
MC9S12DT512CPVE 制造商:Freescale Semiconductor 功能描述:16-BIT HCS12 CISC 512KB FLASH 2.5V/5V 112-PIN LQFP BRICK - Bulk
MC9S12E128CFU 功能描述:16位微控制器 - MCU 16 Bit 16MHz RoHS:否 制造商:Texas Instruments 核心:RISC 处理器系列:MSP430FR572x 数据总线宽度:16 bit 最大时钟频率:24 MHz 程序存储器大小:8 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:2 V to 3.6 V 工作温度范围:- 40 C to + 85 C 封装 / 箱体:VQFN-40 安装风格:SMD/SMT
MC9S12E128CFUE 功能描述:16位微控制器 - MCU 16 Bit 16MHz RoHS:否 制造商:Texas Instruments 核心:RISC 处理器系列:MSP430FR572x 数据总线宽度:16 bit 最大时钟频率:24 MHz 程序存储器大小:8 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:2 V to 3.6 V 工作温度范围:- 40 C to + 85 C 封装 / 箱体:VQFN-40 安装风格:SMD/SMT
MC9S12E128CPV 功能描述:16位微控制器 - MCU 16 Bit 16MHz RoHS:否 制造商:Texas Instruments 核心:RISC 处理器系列:MSP430FR572x 数据总线宽度:16 bit 最大时钟频率:24 MHz 程序存储器大小:8 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:2 V to 3.6 V 工作温度范围:- 40 C to + 85 C 封装 / 箱体:VQFN-40 安装风格:SMD/SMT