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参数资料
| 型号： | MCE4CT-A2-0000-00A5AAAA1 |
| 厂商： | Cree Inc |
| 文件页数： | 4/14页 |
| 文件大小： | 934K |
| 描述： | LED RGBW XLAMP WTR CLR SMD |
| 产品培训模块： | XLamp MC-E XLamp Color Portfolio |
| 产品目录绘图： | MCE4(E,W)T Series Bottom MCE4(E,W)T Series Side MCE4(E,W)T Series Top |
| 标准包装： | 1 |
| 系列： | Xlamp® MC-E |
| 颜色： | 蓝，绿，红，冷白色（RGBW） |
| 电流 - 最大： | 4 x 700mA |
| 正向电压： | 2.1V 红，3.4V 绿，3.2V 蓝，3.2V 白 |
| 流明 @ 电流 - 最大： | 58 lm 红，106 lm 绿，14 lm 蓝，175 lm 冷白色 |
| 在特定电流下的光通量 - 测试： | 30.6 lm 红，67.2 lm 绿，8.2 lm 蓝，100 lm 冷白色 |
| 流明/瓦 @ 电流 - 测试： | 42 lm/W 红，56 lm/W 绿，7 lm/W 蓝，89 lm/W 冷白色 |
| 电流 - 测试： | 4 x 350mA |
| 波长： | 625nm，527.5nm，457.5nm，6350K |
| 透镜样式/尺寸： | 圆形，带圆顶，3.18mm |
| 视角： | 115° |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 0.38" L x 0.28" W x 0.18" H（7.5mm x 7mm x 4.48mm） |
| 包装： | 标准包装 |
| 产品目录页面： | 2895 (CN2011-ZH PDF) |
| 配用： | 876-1003-ND - LM3406 LED DRIVER EVAL BOARD 803772-ND - BOARD LED IMS CREE XLAMP MC-E |
| 其它名称： | MCE4CT-A2-0000-00A5AAAA1DKR |
D8
UNLESS OTHERWISE SPECIFIED
Copyright ? 2008-2014 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree?v, the Cree logo, XLampDIMENSIONS ARE IN
?R.Chaloupecky
and EasyWhite
10/16/07X° ± 2°?
are
MILLIMETERS & BEFORE FINISH.6
5
4
3
RECOMMENDED PCB SOLDER PADregistered trademarks of Cree, Inc.
12
CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT
MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY
UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENT
OF CREE INC.
xlamp mC-e leds
mechanical dimensions
all measurements are ±.1mm unless otherwise indicated..05±.05
Top 8
7
view6
Bottom view
Side view
9.0+.2.0
.80
TYP.
7.50
CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATIONMAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY
CONTAINED WITHIN ARE THE PROPRIETARY ANDUNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENT7.00OF CREE INC.
.75 +.13-.03
.10
NOTICE1.50
BSC
CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATIONPITCH
D
1
2
3
4
5
6
7
8
.05±.05
.25
1.45
R3.18
4.48±.20
A
5.40
2.60
2.84
7.70
10.02
5.60
1.00
TYP.
1.50
BSC
PITCH
2.75
1.16
3.85
1.30
2.00
7090MC PARALLEL / INDEPENDENT
CONFIGURATION
D8
D7
D6
D5
D4
D3
D2
D1
NEGATIVE (-) 4
5
4
POSITIVE (+) 4
NEGATIVE (-) 3
6
3
POSITIVE (+) 3
NEGATIVE (-) 2
7
2
POSITIVE (+) 2
8
HEATSINK1
NEGATIVE (-) 1
POSITIVE (+) 1
HEATSINK
RECOMMENDED PCB SOLDER PAD
Tolerances:
.10
Solder mask windows must be .05 mm bigger
than PCB Solder Pad.
1.
2.
D1
D4
D2
D3
REVISIONS
REV
COMMENTS
DATE
APPROVED BY
A
Initial Release
10/16/07
RC
B
Change height due to new lens
10/23/2007
RC
C
Change recommended solder pad footprint
11/26/2007
RC
D
Height change due to new lens (was 3.86)
12/26/2007
RC
E
- Change package height FROM 1.5 TO 1.45
- Add LED reference designators
- Delete Series Configuration schematic
- Add tabs to recommended PCB footprint
5/12/2008
CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATIONRC
SHEET 1 OF 1
7090MC PARALLEL / INDEPENDENT
CONFIGURATION
7NEGATIVE (-) 2
20:1
2610-00005
SIZE
TITLE
REV.
C
DRAWING NO.
DATE
DATE
DATE
CHECK
FINAL PROTECTIVE FINISH
MATERIAL
APPROVED
DRAWN BY
THIRD ANGLE PROJECTION
.X ± 0.3
X° ± 2°
5.60
.XX ± .10
.X ± .25
FOR SHEET METAL PARTS ONLYB
.XX ± .13
X° ± 1°
UNLESS OTHERWISE SPECIFIED
DIMENSIONS ARE IN
MILLIMETERS & BEFORE FINISH.
TOLERANCE UNLESS SPECIFIED:
SCALE
A
B
C
D
1
2
3
4
5
6
6
5
4
3
2
2.00
7090MC PARALLEL / INDEPENDENT1
A
B
C
D
4600 Silicon Drive
Durham, N.C 27703
UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENT
MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY
CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT
CONTAINED WITHIN ARE THE PROPRIETARY AND
CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION
OF CREE INC.
NOTICE
OUTLINE DRAWING,
7090MC PACKAGE
E
R.Chaloupecky
10/16/07
Ban Loh
Height change due to new lens (was 3.86)
9.0+.2
- Change package height FROM 1.5 TO 1.45
- Add LED reference designators
.0
- Delete Series Configuration schematic
- Add tabs to recommended PCB footprint
.80
TYP.
7.50
7.00
.75 +.13-.03
.10
1.50
BSC
PITCH
1
2
3
4
5
6
7
8
Change recommended solder pad footprint
1
2
.253
- Change package height FROM 1.5 TO 1.45
4
- Add LED reference designators
- Delete Series Configuration schematic
- Add tabs to recommended PCB footprint
1.45
TYP.
Change recommended solder pad footprint
R3.18DATE10/16/07
4.48±.20
A
5.40
2.60
2.84
7.70
10.02
R5.603.18
1.00
TYP.
D2
D3
1.50
BSC
PITCH
2.75
.2
1.16
3.85
1.30
5
2.00
7090MC PARALLEL / INDEPENDENT
CONFIGURATION
D8
D7
D6
D5
D4
D3
D2
D1
NEGATIVE (-) 4
5
4
POSITIVE (+) 4
NEGATIVE (-) 3
6
3
POSITIVE (+) 3
hite
NEGATIVE (-) 2
7
2
POSITIVE (+) 2
8
1
hite
NEGATIVE (-) 1
POSITIVE (+) 1
HEATSINK
RECOMMENDED PCB SOLDER PAD
Tolerances:
.10
Solder mask windows must be .05 mm bigger CONFIGURATION
than PCB Solder Pad.
D6
1.
2.
D1
D4
D211/26/200712/26/2007D3
REVISIONS
REV
COMMENTS
DATE
APPROVED BY
A
Initial Release
10/16/07
RC
B
Change height due to new lens
10/23/2007
RC
C
Change recommended solder pad footprint
11/26/2007
RC
D
Height change due to new lens (was 3.86)
12/26/2007
RC
E
- Change package height FROM 1.5 TO 1.45
- Add LED reference designators
- Delete Series Configuration schematic
- Add tabs to recommended PCB footprint
5/12/2008
RC
SHEET 1 OF 1
20:1
2610-00005
SIZE
TITLE
REV.
C
DRAWING NO.
DATE
DATE
DATE
CHECK
FINAL PROTECTIVE FINISH
MATERIAL
APPROVED
DRAWN BY
THIRD ANGLE PROJECTION
.X ± 0.3
X° ± 2°
.XX ± .10
.X ± .25
FOR SHEET METAL PARTS ONLY
.XX ± .13
X° ± 1°
UNLESS OTHERWISE SPECIFIED
DIMENSIONS ARE IN
MILLIMETERS & BEFORE FINISH.
TOLERANCE UNLESS SPECIFIED:
SCALE
A
B
C
D
1
2
3
4
5
6
16
5
4
3
2
1
A
B
C
D
4600 Silicon Drive
Durham, N.C 27703
CONTAINED WITHIN ARE THE PROPRIETARY AND
NOTICE
OUTLINE DRAWING,
7090MC PACKAGE
E
R.Chaloupecky
10/16/07
Ban Loh
9.0+.0
.80
9.0+.2.0
TYP.1
7.50
7.00
.75 +.13-.03
CONFIGURATION.10
1.50
BSC
PITCH
1
2
3
4
5
6
7
8
.05±.05
.25
1.45
R3.18
1.454.48±.20
A
5.40
2.60
RECOMMENDED PCB SOLDER PAD2.84
7.70
10.02
5.60
1.00
TYP.
1.50
BSC
PITCH
2.75
1.16
3.85
than PCB Solder Pad.1.30
2.00
ad
5NEGATIVE (-) 4D7
6NEGATIVE (-) 3D6
1.30
7NEGATIVE (-) 2D5
D4
D3
D2
D1
NEGATIVE (-) 4
5
4
POSITIVE (+) 4
NEGATIVE (-) 3
6
3
POSITIVE (+) 3
NEGATIVE (-) 2
7
2
POSITIVE (+) 2
8
NEGATIVE (-) 1
POSITIVE (+) 1
RECOMMENDED PCB SOLDER PAD1.
Tolerances:
.10
2.
Solder mask windows must be .05 mm bigger
than PCB Solder Pad.
Tolerances:
.10
Solder mask windows must be .05 mm bigger
than PCB Solder Pad.
1.
2.
D1
D4
REVISIONS
REV
COMMENTS
APPROVED BY10/23/2007
A
Initial Release
C
11/26/2007RC
B
Change height due to new lens
D
Height change due to new lens (was 3.86)
10/23/2007
12/26/2007RC
C
11/26/2007
RC
D
Height change due to new lens (was 3.86)
E
12/26/2007
5/12/2008RC
E
- Change package height FROM 1.5 TO 1.45
- Add LED reference designators
- Delete Series Configuration schematic
Color
- Add tabs to recommended PCB footprint
5/12/2008
RC
SHEET 1 OF 1
20:1
20:12610-00005
SIZE
TITLE
REV.
2
C
DRAWING NO.SCALE
DATE
DATE
DATEBan Loh
.XX ± .13CHECK
FINAL PROTECTIVE FINISH
.X ± .25MATERIAL
.XX ± .10
X° ± 1°APPROVED
TOLERANCE UNLESS SPECIFIED:DRAWN BY
THIRD ANGLE PROJECTION
.X ± 0.3
X° ± 2°
.XX ± .10
.X ± .25
FOR SHEET METAL PARTS ONLYX° ± 2°
.XX ± .13FOR SHEET METAL PARTS ONLY
X° ± 1°
UNLESS OTHERWISE SPECIFIED
DIMENSIONS ARE IN
MILLIMETERS & BEFORE FINISH.
THIRD ANGLE PROJECTIONTOLERANCE UNLESS SPECIFIED:
SCALE
A
B
C
D
1
2
3
4
CONTAINED WITHIN ARE THE PROPRIETARY AND
5
6
6
5
4
3
2
1
A
B
C
D
4600 Silicon Drive
Durham, N.C 27703
UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENT
MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY
CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT
OF CREE INC.
CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT NOTICE
OUTLINE DRAWING,
SIZE
DRAWING NO.
7090MC PACKAGE2610-00005
E
1
R.Chaloupecky.X ± 0.3
10/16/07
Ban Loh
.25
9.0+.2.0
.80
TYP.
7.50
7.00
.75 +.13-.03
.10
1.50
BSC
PITCH
2
3
7.504
6
7
8
.05±.05
.25
R3.18
4.48±.20
A
5.40
2.60
2.84
7.70
10.02
1.00
TYP.
1.50
BSC
PITCH
2.75
1.16
3.85
Tolerances:
.101.30
Solder mask windows must be .05 mm bigger Recommended pCB Solder p
2.75
2.00
D8
D7
D6
D5
D4
D3
D2
NEGATIVE (-) 4
D1
NEGATIVE (-) 3
4
POSITIVE (+) 4
3
POSITIVE (+) 3
2
5POSITIVE (+) 2
10.028
1
2.84
7.70NEGATIVE (-) 1
6POSITIVE (+) 1
HEATSINK
D1
D4
D2
D3
REVISIONS
REV
COMMENTS
DATE
APPROVED BY
A
.80
Initial Release
10/16/07
RC
B
Change height due to new lens
RC
RC
RC
RC
SHEET 1 OF 1
TITLE
REV.
C
DATE
DATE
DATE.XX ± .10
CHECK
FINAL PROTECTIVE FINISH
MATERIAL
APPROVED
DRAWN BY
A
B
C
D
1
2
3
4
5
6
6
5
4
3
A
B
C
D
4600 Silicon DriveSCALE
20:1
Durham, N.C 27703
OUTLINE DRAWING,
7090MC PACKAGE
E
OF CREE INC.
Top view
D1: Cool 7.00
white
.75 +.13-.03
.10
1.50
BSC
PITCH
5
.05±.05
1.45
4.48±.20
A
5.40
2.60
5.60
1.00
TYP.
1.50
BSC
PITCH
1.16
3.85
7090MC PARALLEL / INDEPENDENT
D8
D7
D5
D4
D3
D2
D1
4
POSITIVE (+) 4
3
POSITIVE (+) 3
2
POSITIVE (+) 2
8
1
NEGATIVE (-) 1
POSITIVE (+) 1
HEATSINK
1.
2.
D2: Green
D3: BlueD1
D4
D1: RedD2
D3
REVISIONS
REV
COMMENTS
DATE
APPROVED BY
A
Initial Release
10/16/07
RC
B
Change height due to new lens
10/23/2007
RC
C
Change recommended solder pad footprint
RC
D
RC
E
5/12/2008
RC
SHEET 1 OF 1
2610-00005
SIZE
TITLE
REV.
C
DRAWING NO.
DATE
DATE
DATE
CHECK
FINAL PROTECTIVE FINISH
MATERIAL
APPROVED
DRAWN BY
THIRD ANGLE PROJECTION
.X ± 0.3
.X ± .25
FOR SHEET METAL PARTS ONLY
.XX ± .13
X° ± 1°
UNLESS OTHERWISE SPECIFIED
DIMENSIONS ARE IN
MILLIMETERS & BEFORE FINISH.
TOLERANCE UNLESS SPECIFIED:
A
C
1
2
3
4
5
6
2
1
A
B
C
D
4600 Silicon Drive
Durham, N.C 27703
UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENT
MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY
CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT
CONTAINED WITHIN ARE THE PROPRIETARY AND
CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION
NOTICE
OUTLINE DRAWING,
7090MC PACKAGE
E
R.Chaloupecky
10/16/07
Ban Loh
D4: white
Dynamic w
D2: warm white
D3: Cool w
D4: warm white
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MCE4CT-A2-KPEK-A3KWC0000 | 制造商:Cree 功能描述: |
| MCE4CT-A2-KPEK-A3KWD0000 | 制造商:Cree 功能描述: |
| MCE4CT-A2-KPEK-A3KWG0000 | 制造商:Cree 功能描述: |
| MCE4CT-A2-KPEK-A4KWC0000 | 制造商:Cree 功能描述: |
| MCE4CT-A2-KPEK-A4KWD0000 | 制造商:Cree 功能描述: |
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