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| 型号： | MCF51JE256CML |
| 厂商： | FREESCALE SEMICONDUCTOR INC |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, FLASH, 50.33 MHz, MICROCONTROLLER, PBGA104 |
| 封装： | 10 X 10 MM, ROHS COMPLIANT, MAPBGA-104 |
| 文件页数： | 9/50页 |
| 文件大小： | 1200K |
| 代理商： | MCF51JE256CML |
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Preliminary Electrical Characteristics
Freescale Semiconductor
1-1
3.3
Thermal Characteristics
This section provides information about operating temperature range, power dissipation, and package
thermal resistance. Power dissipation on I/O pins is usually small compared to the power dissipation in
on-chip logic and it is user-determined rather than being controlled by the MCU design. In order to take
PI/O into account in power calculations, determine the difference between actual pin voltage and VSS or
VDD and multiply by the pin current for each I/O pin. Except in cases of unusually high pin current (heavy
loads), the difference between pin voltage and VSS or VDD will be very small.
The average chip-junction temperature (TJ) in °C can be obtained from:
TJ = TA + (PD × θJA)
Eqn. 1
where:
TA = Ambient temperature, °C
θ
JA = Package thermal resistance, junction-to-ambient, °C/W
PD = Pint + PI/O
Pint = IDD × VDD, Watts — chip internal power
PI/O = Power dissipation on input and output pins — user determined
For most applications, PI/O << Pint and can be neglected. An approximate relationship between PD and TJ
(if PI/O is neglected) is:
Table 6. Thermal Characteristics
#
Symbol
Rating
Value
Unit
1TA
Operating temperature range (packaged):
°C
MCF51JE256
–40 to 105
MCF51JE128
–40 to 105
2TJMAX
Maximum junction temperature
135
°C
3
θ
JA
Thermal resistance1,2,3,4 Single-layer board — 1s
1
Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance.
2
Junction to Ambient Natural Convection
3
1s — Single layer board, one signal layer
4
2s2p — Four layer board, 2 signal and 2 power layers
°C/W
104-pin MBGA
67
100-pin LQFP
53
81-pin MBGA
67
80-pin LQFP
53
4
θ
JA
Thermal resistance1, 2, 3, 4 Four-layer board — 2s2p
°C/W
104-pin MBGA
39
100-pin LQFP
41
81-pin MBGA
39
80-pin LQFP
39
Preliminary — Subject to Change
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MCF51JE256CMLJ | 功能描述:32位微控制器 - MCU FLASH-NON-ANALOG IP 256K RoHS:否 制造商:Texas Instruments 核心:C28x 处理器系列:TMS320F28x 数据总线宽度:32 bit 最大时钟频率:90 MHz 程序存储器大小:64 KB 数据 RAM 大小:26 KB 片上 ADC:Yes 工作电源电压:2.97 V to 3.63 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:LQFP-80 安装风格:SMD/SMT |
| MCF51JE256VLK | 功能描述:32位微控制器 - MCU FLASH-NON-ANALOG IP 256K RoHS:否 制造商:Texas Instruments 核心:C28x 处理器系列:TMS320F28x 数据总线宽度:32 bit 最大时钟频率:90 MHz 程序存储器大小:64 KB 数据 RAM 大小:26 KB 片上 ADC:Yes 工作电源电压:2.97 V to 3.63 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:LQFP-80 安装风格:SMD/SMT |
| MCF51JE256VLL | 功能描述:32位微控制器 - MCU FLASH-NON-ANALOG IP 256K RoHS:否 制造商:Texas Instruments 核心:C28x 处理器系列:TMS320F28x 数据总线宽度:32 bit 最大时钟频率:90 MHz 程序存储器大小:64 KB 数据 RAM 大小:26 KB 片上 ADC:Yes 工作电源电压:2.97 V to 3.63 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:LQFP-80 安装风格:SMD/SMT |
| MCF51JE256VMB | 功能描述:32位微控制器 - MCU 256k Flash Non-analog IP RoHS:否 制造商:Texas Instruments 核心:C28x 处理器系列:TMS320F28x 数据总线宽度:32 bit 最大时钟频率:90 MHz 程序存储器大小:64 KB 数据 RAM 大小:26 KB 片上 ADC:Yes 工作电源电压:2.97 V to 3.63 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:LQFP-80 安装风格:SMD/SMT |
| MCF51JE256VMBJ | 制造商:Freescale Semiconductor 功能描述:256K FLASH-NON-ANALOG IP - Bulk |
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