
MCF51JM128 ColdFire Microcontroller, Rev. 3
Preliminary Electrical Characteristics
Freescale Semiconductor
16
2.3
Thermal Characteristics
This section provides information about operating temperature range, power dissipation, and package thermal resistance. Power
dissipation on I/O pins is usually small compared to the power dissipation in on-chip logic and it is user-determined rather than
being controlled by the MCU design. To take PI/O into account in power calculations, determine the difference between actual
pin voltage and VSS or VDD and multiply by the pin current for each I/O pin. Except in cases of unusually high pin current
(heavy loads), the difference between pin voltage and VSS or VDD is small.
Table 6. Absolute Maximum Ratings
Rating
Symbol
Value
Unit
Supply voltage
VDD
–0.3 to 5.8
V
Input voltage
VIn
–0.3 to VDD + 0.3
V
Instantaneous maximum current
Single pin limit
(applies to all port pins)1, 2, 3
1 Input must be current limited to the value specified. To determine the value of the required
current-limiting resistor, calculate resistance values for positive (VDD) and negative (VSS) clamp
voltages, then use the larger of the two resistance values.
2 All functional non-supply pins are internally clamped to V
SS and VDD.
3 Power supply must maintain regulation within operating V
DD range during instantaneous and
operating maximum current conditions. If positive injection current (VIn > VDD) is greater than
IDD, the injection current may flow out of VDD and could result in external power supply going
out of regulation. Ensure external VDD load shunt current is greater than maximum injection
current. This is the greatest risk when the MCU is not consuming power. Examples: if no system
clock is present or if the clock rate is low, which would reduce overall power consumption.
ID
±25
mA
Maximum current into VDD
IDD
120
mA
Storage temperature
Tstg
–55 to 150
°C
Maximum junction temperature
TJ
150
°C
Table 7. Thermal Characteristics
Rating
Symbol
Value
Unit
Operating temperature range (packaged)
TA
–40 to 105
°C
Thermal resistance 1,2,3,4
80-pin LQFP
1s
2s2p
64-pin LQFP
1s
2s2p
64-pin QFP
1s
2s2p
44-pin LQFP
1s
2s2p
1 Junction temperature is a function of die size, on-chip power dissipation, package thermal
resistance, mounting site (board) temperature, ambient temperature, air flow, power dissipation
of other components on the board, and board thermal resistance.
2 Junction to Ambient Natural Convection
θ
JA
52
40
65
47
54
40
69
48
°C/W