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| 型号： | MCF5208CAB166 |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 10/46页 |
| 文件大小： | 0K |
| 描述： | MCU 32BIT 166.67MHZ 160-QFP |
| 标准包装： | 24 |
| 系列： | MCF520x |
| 核心处理器： | Coldfire V2 |
| 芯体尺寸： | 32-位 |
| 速度： | 166.67MHz |
| 连通性： | EBI/EMI，以太网，I²C，SPI，UART/USART |
| 外围设备： | DMA，WDT |
| 输入/输出数： | 50 |
| 程序存储器类型： | ROMless |
| RAM 容量： | 16K x 8 |
| 电压 - 电源 (Vcc/Vdd)： | 1.4 V ~ 3.6 V |
| 振荡器型： | 外部 |
| 工作温度： | -40°C ~ 85°C |
| 封装/外壳： | 160-BQFP |
| 包装： | 托盘 |
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MCF5208 ColdFire Microprocessor Data Sheet, Rev. 3
Electrical Characteristics
Freescale Semiconductor
18
5.2
Thermal Characteristics
Table 5 lists thermal resistance values
Operating Temperature Range (Packaged)
TA
(TL - TH)
– 40 to 85
°C
Storage Temperature Range
Tstg
– 55 to 150
°C
NOTES:
1
Functional operating conditions are given in Section 5.4, “DC Electrical Specifications”.
Absolute maximum ratings are stress ratings only, and functional operation at the maxima is
not guaranteed. Continued operation at these levels may affect device reliability or cause
permanent damage to the device.
2
This device contains circuitry protecting against damage due to high static voltage or
electrical fields; however, it is advised that normal precautions be taken to avoid application of
any voltages higher than maximum-rated voltages to this high-impedance circuit. Reliability of
operation is enhanced if unused inputs are tied to an appropriate logic voltage level (VSS or
EVDD).
3
Input must be current limited to the value specified. To determine the value of the required
current-limiting resistor, calculate resistance values for positive and negative clamp voltages,
then use the larger of the two values.
4 All functional non-supply pins are internally clamped to V
SS and EVDD.
5
Power supply must maintain regulation within operating EVDD range during instantaneous
and operating maximum current conditions. If positive injection current (Vin > EVDD) is greater
than IDD, the injection current may flow out of EVDD and could result in external power supply
going out of regulation. Ensure external EVDD load shunts current greater than maximum
injection current. This is the greatest risk when the MCU is not consuming power (ex; no
clock). Power supply must maintain regulation within operating EVDD range during
instantaneous and operating maximum current conditions.
Table 5. Thermal Characteristics
Characteristic
Symbol
196MBGA 144MBGA 160QFP 144LQFP
Unit
Junction to ambient, natural convection
Four layer board
(2s2p)
θ
JMA
471,2
NOTES:
1
θ
JMA and Ψjt parameters are simulated in conformance with EIA/JESD Standard 51-2 for natural convection. Freescale
recommends the use of
θ
JmA and power dissipation specifications in the system design to prevent device junction temperatures
from exceeding the rated specification. System designers should be aware that device junction temperatures can be significantly
influenced by board layout and surrounding devices. Conformance to the device junction temperature specification can be
verified by physical measurement in the customer’s system using the
Ψ
jt parameter, the device power dissipation, and the
method described in EIA/JESD Standard 51-2.
2 Per JEDEC JESD51-6 with the board horizontal.
471,2
491,2
651,2
°C/W
Junction to ambient (@200 ft/min)
Four layer board
(2s2p)
θ
JMA
431,2
441,2
581,2
°C/W
Junction to board
θ
JB
363
403
503
°C/W
Junction to case
θ
JC
224
394
194
°C/W
Junction to top of package
Ψ
jt
61,5
121,6
51,7
°C/W
Maximum operating junction temperature
Tj
105
oC
Table 4. Absolute Maximum Ratings1, 2 (continued)
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