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参数资料
型号： MCF52221CAF66
厂商： FREESCALE SEMICONDUCTOR INC
元件分类： 微控制器/微处理器
英文描述： 32-BIT, FLASH, 66 MHz, RISC MICROCONTROLLER, PQFP100
封装： 14 X 14 MM, 1.40 MM HEIGHT, ROHS COMPLIANT, LQFP-100
文件页数： 24/55页
文件大小： 980K
代理商： MCF52221CAF66
Electrical Characteristics
MCF52223 ColdFire Microcontroller, Rev. 3
Freescale Semiconductor
30
2.3
Thermal Characteristics
Table 24 lists thermal resistance values.
Table 24. Thermal Characteristics
Characteristic
Symbol
Value
Unit
100 LQFP
Junction to ambient, natural convection
Single layer board (1s)
JA
531,2
1
JA and jt parameters are simulated in conformance with EIA/JESD Standard 51-2 for natural convection. Freescale
recommends the use of
JA and power dissipation specifications in the system design to prevent device junction
temperatures from exceeding the rated specification. System designers should be aware that device junction temperatures
can be significantly influenced by board layout and surrounding devices. Conformance to the device junction temperature
specification can be verified by physical measurement in the customer’s system using the
jt parameter, the device power
dissipation, and the method described in EIA/JESD Standard 51-2.
2 Per JEDEC JESD51-2 with the single-layer board (JESD51-3) horizontal.
C/W
Junction to ambient, natural convection
Four layer board (2s2p)
JA
391,3
3 Per JEDEC JESD51-6 with the board JESD51-7) horizontal.
C/W
Junction to ambient, (@200 ft/min)
Single layer board (1s)
JMA
421,3
C/W
Junction to ambient, (@200 ft/min)
Four layer board (2s2p)
JMA
331,3
C/W
Junction to board
—
JB
254
4 Thermal resistance between the die and the printed circuit board in conformance with JEDEC JESD51-8. Board
temperature is measured on the top surface of the board near the package.
C/W
Junction to case
—
JC
95
5 Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883
Method 1012.1).
C/W
Junction to top of package
Natural convection
jt
26
C/W
Maximum operating junction temperature
—
Tj
105
oC
81 MAPBGA Junction to ambient, natural convection
Single layer board (1s)
JA
611,2
C/W
Junction to ambient, natural convection
Four layer board (2s2p)
JA
352,3
C/W
Junction to ambient, (@200 ft/min)
Single layer board (1s)
JMA
502,3
C/W
Junction to ambient, (@200 ft/min)
Four layer board (2s2p)
JMA
312,3
C/W
Junction to board
—
JB
204
C/W
Junction to case
—
JC
125
C/W
Junction to top of package
Natural convection
jt
26
C/W
Maximum operating junction temperature
—
Tj
105
oC
64 LQFP
Junction to ambient, natural convection
Single layer board (1s)
JA
621,2
C/W
Junction to ambient, natural convection
Four layer board (2s2p)
JA
431,3
C/W
Junction to ambient (@200 ft/min)
Single layer board (1s)
JMA
501,3
C/W
Junction to ambient (@200 ft/min)
Four layer board (2s2p)
JMA
361,3
C/W
Junction to board
—
JB
264
C/W
Junction to case
—
JC
95
C/W
Junction to top of package
Natural convection
jt
26
C/W
Maximum operating junction temperature
—
Tj
105
oC
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相关代理商/技术参数
参数描述
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MCF52221CVM66 功能描述:32位微控制器 - MCU 32-BIT MCU W/ USB FS OTG RoHS:否 制造商:Texas Instruments 核心:C28x 处理器系列:TMS320F28x 数据总线宽度:32 bit 最大时钟频率:90 MHz 程序存储器大小:64 KB 数据 RAM 大小:26 KB 片上 ADC:Yes 工作电源电压:2.97 V to 3.63 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:LQFP-80 安装风格:SMD/SMT
MCF52221CVM80 功能描述:32位微控制器 - MCU 32-BIT MCU W/ USB FS OTG RoHS:否 制造商:Texas Instruments 核心:C28x 处理器系列:TMS320F28x 数据总线宽度:32 bit 最大时钟频率:90 MHz 程序存储器大小:64 KB 数据 RAM 大小:26 KB 片上 ADC:Yes 工作电源电压:2.97 V to 3.63 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:LQFP-80 安装风格:SMD/SMT
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MCF52223_07 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:ColdFire Microcontroller
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