参数资料
型号: MCF5232CVM100
厂商: MOTOROLA INC
元件分类: 微控制器/微处理器
英文描述: 32-BIT, 100 MHz, RISC PROCESSOR, PBGA196
封装: MAPBGA-196
文件页数: 27/76页
文件大小: 2665K
代理商: MCF5232CVM100
MOTOROLA
MCF523x Integrated Microprocessor Hardware Specifications
33
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Power Supply
4.2
Power Supply
33
F, .1 F and .01 F across each power supply
4.3
Decoupling
Place the decoupling caps as close to the pins as possible, but they can be outside the footprint of
the package.
.1
F and .01 F at each supply input
4.4
Buffering
Use bus buffers on all data/address lines for all off-board accesses and for all on-board accesses
when excessive loading is expected. See Section 6, “Preliminary Electrical Characteristics.”
4.5
Pull-up Recommendations
Use external pull-up resistors on unused inputs. See pin table.
4.6
Clocking Recommendations
Use a multi-layer board with a separate ground plane.
Place the crystal and all other associated components as close to the EXTAL and XTAL (oscillator
pins) as possible.
Do not run a high frequency trace around crystal circuit.
Ensure that the ground for the bypass capacitors is connected to a solid ground trace.
Tie the ground trace to the ground pin nearest EXTAL and XTAL. This prevents large loop
currents in the vicinity of the crystal.
Tie the ground pin to the most solid ground in the system.
Do not connect the trace that connects the oscillator and the ground plane to any other circuit
element. This tends to make the oscillator unstable.
Tie XTAL to ground when an external oscillator is clocking the device.
4.7
Interface Recommendations
4.7.1
SDRAM Controller
4.7.1.1
SDRAM Controller Signals in Synchronous Mode
Table 20 shows the behavior of SDRAM signals in synchronous mode.
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相关代理商/技术参数
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MCF5232CVM100 制造商:Freescale Semiconductor 功能描述:Microprocessor IC
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MCF5232CVM150 功能描述:微处理器 - MPU MCF5232 V2CORE 64KSRAM RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
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