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参数资料
| 型号： | MCF5234CVM100 |
| 厂商： | FREESCALE SEMICONDUCTOR INC |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 100 MHz, RISC PROCESSOR, PBGA256 |
| 封装： | ROHS COMPLIANT, MAPBGA-256 |
| 文件页数： | 3/48页 |
| 文件大小： | 666K |
| 代理商： | MCF5234CVM100 |
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Design Recommendations
MCF523x Integrated Microprocessor Hardware Specification, Rev. 4
Freescale Semiconductor
11
5.2.1.2
Power Down Sequence
If VDD is powered down first, then sense circuits in the I/O pads cause all output drivers to be in a high
impedance state. There is no limit on how long after VDD powers down before OVDD/VDDPLL must power
down. VDD should not lag OVDD or VDDPLL going low by more than 0.4 V during power down or there
will be undesired high current in the ESD protection diodes. There are no requirements for the fall times
of the power supplies.
The recommended power down sequence is as follows:
1. Drop VDD to 0 V.
2. Drop OVDD/VDDPLL supplies.
5.3
Decoupling
Place the decoupling caps as close to the pins as possible, but they can be outside the footprint of
the package.
0.1
μF and 0.01 μF at each supply input
5.4
Buffering
Use bus buffers on all data/address lines for all off-board accesses and for all on-board accesses
when excessive loading is expected. See Section 7, “Electrical Characteristics.”
5.5
Pull-up Recommendations
Use external pull-up resistors on unused inputs. See pin table.
5.6
Clocking Recommendations
Use a multi-layer board with a separate ground plane.
Place the crystal and all other associated components as close to the EXTAL and XTAL (oscillator
pins) as possible.
Do not run a high frequency trace around crystal circuit.
Ensure that the ground for the bypass capacitors is connected to a solid ground trace.
Tie the ground trace to the ground pin nearest EXTAL and XTAL. This prevents large loop currents
in the vicinity of the crystal.
Tie the ground pin to the most solid ground in the system.
Do not connect the trace that connects the oscillator and the ground plane to any other circuit
element. This tends to make the oscillator unstable.
Tie XTAL to ground when an external oscillator is clocking the device.
相关PDF资料 |
PDF描述 |
|---|---|
| MCF5232CVM100 | 32-BIT, 100 MHz, RISC PROCESSOR, PBGA196 |
| MCF5233CVM150 | 32-BIT, 150 MHz, RISC PROCESSOR, PBGA256 |
| MCF5235CVM100 | 32-BIT, 100 MHz, RISC PROCESSOR, PBGA256 |
| MCF5232CVM150 | 32-BIT, 150 MHz, RISC PROCESSOR, PBGA196 |
| MCF5235CVM150 | 32-BIT, 150 MHz, RISC PROCESSOR, PBGA256 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| MCF5234CVM100J | 功能描述:32位微控制器 - MCU V2CORE 64KSRAM RoHS:否 制造商:Texas Instruments 核心:C28x 处理器系列:TMS320F28x 数据总线宽度:32 bit 最大时钟频率:90 MHz 程序存储器大小:64 KB 数据 RAM 大小:26 KB 片上 ADC:Yes 工作电源电压:2.97 V to 3.63 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:LQFP-80 安装风格:SMD/SMT |
| MCF5234CVM150 | 功能描述:IC MPU 32BIT COLDFIRE 256-MAPBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - 微控制器， 系列:MCF523x 标准包装:1 系列:AVR® ATmega 核心处理器:AVR 芯体尺寸:8-位 速度:16MHz 连通性:I²C，SPI，UART/USART 外围设备:欠压检测/复位，POR，PWM，WDT 输入/输出数:32 程序存储器容量:32KB（16K x 16） 程序存储器类型:闪存 EEPROM 大小:1K x 8 RAM 容量:2K x 8 电压 - 电源 (Vcc/Vdd):2.7 V ~ 5.5 V 数据转换器:A/D 8x10b 振荡器型:内部 工作温度:-40°C ~ 125°C 封装/外壳:44-TQFP 包装:剪切带 (CT) 其它名称:ATMEGA324P-B15AZCT |
| MCF5234CVM150 | 制造商:Freescale Semiconductor 功能描述:Microprocessor IC |
| MCF5234CVM150J | 功能描述:32位微控制器 - MCU V2CORE 64KSRAM RoHS:否 制造商:Texas Instruments 核心:C28x 处理器系列:TMS320F28x 数据总线宽度:32 bit 最大时钟频率:90 MHz 程序存储器大小:64 KB 数据 RAM 大小:26 KB 片上 ADC:Yes 工作电源电压:2.97 V to 3.63 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:LQFP-80 安装风格:SMD/SMT |
| MCF5235 | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:Integrated Microprocessor Hardware Specification |
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