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| 型号： | MCF5274VM166 |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 11/44页 |
| 文件大小： | 0K |
| 描述： | IC MCU 32BIT 166MHZ 256-MAPBGA |
| 标准包装： | 90 |
| 系列： | MCF527x |
| 核心处理器： | Coldfire V2 |
| 芯体尺寸： | 32-位 |
| 速度： | 166MHz |
| 连通性： | EBI/EMI，以太网，I²C，SPI，UART/USART，USB |
| 外围设备： | DMA，WDT |
| 输入/输出数： | 69 |
| 程序存储器类型： | ROMless |
| RAM 容量： | 64K x 8 |
| 电压 - 电源 (Vcc/Vdd)： | 1.4 V ~ 1.6 V |
| 振荡器型： | 外部 |
| 工作温度： | 0°C ~ 70°C |
| 封装/外壳： | 256-LBGA |
| 包装： | 散装 |
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Electrical Characteristics
MCF5275 Integrated Microprocessor Family Hardware Specification, Rev. 4
Freescale Semiconductor
19
8.2
Thermal Characteristics
Table 8 lists thermal resistance values
2
This device contains circuitry protecting against damage due to high static voltage or electrical fields;
however, it is advised that normal precautions be taken to avoid application of any voltages higher than
maximum-rated voltages to this high-impedance circuit. Reliability of operation is enhanced if unused
inputs are tied to an appropriate logic voltage level (e.g., VSS or O VDD).
3
Input must be current limited to the value specified. To determine the value of the required
current-limiting resistor, calculate resistance values for positive and negative clamp voltages, then use
the larger of the two values.
4
All functional non-supply pins are internally clamped to VSS and O VDD.
5
Power supply must maintain regulation within operating O VDD range during instantaneous and
operating maximum current conditions. If positive injection current (Vin > O VDD) is greater than IDD, the
injection current may flow out of O VDD and could result in external power supply going out of
regulation. Ensure the external O VDD load shunts current greater than maximum injection current. This
is the greatest risk when the MCU is not consuming power (ex; no clock).Power supply must maintain
regulation within operating VDD range during instantaneous and operating maximum current conditions.
Table 8. Thermal characteristics
Characteristic
Symbol
256MBGA
196MBGA
Unit
Junction to ambient, natural convection
Four layer board (2s2p)
θ
JMA
261,2
1
θ
JMA and Ψjt parameters are simulated in conformance with EIA/JESD Standard 51-2 for natural convection. Freescale
recommends the use of
θ
JmA and power dissipation specifications in the system design to prevent device junction
temperatures from exceeding the rated specification. System designers should be aware that device junction temperatures
can be significantly influenced by board layout and surrounding devices. Conformance to the device junction temperature
specification can be verified by physical measurement in the customer’s system using the
Ψ
jt parameter, the device power
dissipation, and the method described in EIA/JESD Standard 51-2.
2
Per JEDEC JESD51-6 with the board horizontal.
°C/W
Junction to ambient (@200 ft/min)
Four layer board (2s2p)
θ
JMA
231,2
°C/W
Junction to board
θ
JB
153
3
Thermal resistance between the die and the printed circuit board in conformance with JEDEC JESD51-8. Board
temperature is measured on the top surface of the board near the package.
203
°C/W
Junction to case
θ
JC
104
4
Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883
Method 1012.1).
104
°C/W
Junction to top of package
Natural convection
Ψ
jt
21,5
5
Thermal characterization parameter indicating the temperature difference between package top and the junction
temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written
in conformance with Psi-JT.
°C/W
Maximum operating junction temperature
Tj
105
oC
The average chip-junction temperature (TJ) in °C can be obtained from:
(1)
Where:
TA
= Ambient Temperature,
°C
Θ
JMA
= Package Thermal Resistance, Junction-to-Ambient,
°C/W
PD
= PINT + PI/O
TJ
TA
PD ΘJMA
×
()
+
=
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相关代理商/技术参数 |
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|---|---|
| MCF5274VM166J | 制造商:Freescale Semiconductor 功能描述:MCF5274 V2CORE 64KSRAM - Bulk |
| MCF5275 | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:Integrated Microprocessor Family Hardware Specification |
| MCF5275CVM133 | 功能描述:IC MCU 32BIT 133MHZ 256-MAPBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - 微控制器， 系列:MCF527x 标准包装:250 系列:56F8xxx 核心处理器:56800E 芯体尺寸:16-位 速度:60MHz 连通性:CAN，SCI，SPI 外围设备:POR，PWM，温度传感器，WDT 输入/输出数:21 程序存储器容量:40KB（20K x 16） 程序存储器类型:闪存 EEPROM 大小:- RAM 容量:6K x 16 电压 - 电源 (Vcc/Vdd):2.25 V ~ 3.6 V 数据转换器:A/D 6x12b 振荡器型:内部 工作温度:-40°C ~ 125°C 封装/外壳:48-LQFP 包装:托盘 配用:MC56F8323EVME-ND - BOARD EVALUATION MC56F8323 |
| MCF5275CVM166 | 功能描述:微处理器 - MPU MCF5275 V2CORE 64KSRAM RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MCF5275CVM166 | 制造商:Freescale Semiconductor 功能描述:Microprocessor IC |
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