参数资料
型号: MCF5329CVM240
厂商: Freescale Semiconductor
文件页数: 40/50页
文件大小: 0K
描述: IC MCU 32BIT 240MHZ 256-MAPBGA
标准包装: 90
系列: MCF532x
核心处理器: Coldfire V3
芯体尺寸: 32-位
速度: 240MHz
连通性: CAN,EBI/EMI,以太网,I²C,SPI,SSI,UART/USART,USB,USB OTG
外围设备: DMA,LCD,PWM,WDT
输入/输出数: 94
程序存储器类型: ROMless
RAM 容量: 32K x 8
电压 - 电源 (Vcc/Vdd): 1.4 V ~ 3.6 V
振荡器型: 外部
工作温度: -40°C ~ 85°C
封装/外壳: 256-LBGA
包装: 托盘
Package Information
MCF532x ColdFire Microprocessor Data Sheet, Rev. 5
Freescale Semiconductor
45
7
Package Information
This section contains drawings showing the pinout and the packaging and mechanical characteristics of the MCF532x devices.
NOTE
The mechanical drawings are the latest revisions at the time of publication of this
document. The most up-to-date mechanical drawings can be found at the product summary
7.1
Package Dimensions—256 MAPBGA
Figure 36 shows MCF5328CVM240, MCF53281CVM240, and MCF5329CVM240 package dimensions.
Figure 36. 256 MAPBGA Package Outline
X
Y
D
E
Laser mark for pin A1
identification in
this area
0.20
Metalized mark for
pin A1 identification
in this area
M
3
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
1
2
3
4
5
6
7
10
11
12
13
14
15
16
e
15X
e
15X
b
256X
M
0.25
Y
Z
M
0.10
X
Z
S
Detail K
View M-M
Rotated 90
° Clockwise
S
A
Z
Z
A2
A1
4
0.15
Z
0.30
256X
5
K
Notes:
1.
Dimensions are in millimeters.
2.
Interpret dimensions and tolerances
per ASME Y14.5M, 1994.
3.
Dimension b is measured at the
maximum solder ball diameter, parallel
to datum plane Z.
4.
Datum Z (seating plane) is defined by
the spherical crowns of the solder
balls.
5.
Parallelism measurement shall exclude
any effect of mark on top surface of
package.
Dim
Min
Max
Millimeters
A
1.25
1.60
A1
0.27
0.47
A2
1.16 REF
b
0.40
0.60
D
17.00 BSC
E
17.00 BSC
e
1.00 BSC
S
0.50 BSC
Top View
Bottom View
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