参数资料
| 型号： | MCF54418CMJ250 |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 15/61页 |
| 文件大小： | 0K |
| 描述： | IC MCU 32BIT 256MAPBGA |
| 标准包装： | 450 |
| 系列： | MCF5441x |
| 核心处理器： | Coldfire V4 |
| 芯体尺寸： | 32-位 |
| 速度： | 250MHz |
| 连通性： | 1 线，CAN，EBI/EMI，以太网，I²C，智能卡，SPI，SSI，UART/USART，USB，USB OTG |
| 外围设备： | DMA，PWM，WDT |
| 输入/输出数： | 87 |
| 程序存储器类型： | ROMless |
| RAM 容量： | 64K x 8 |
| 电压 - 电源 (Vcc/Vdd)： | 1.14 V ~ 1.32 V |
| 数据转换器： | A/D 8x12b，D/A 2x12b |
| 振荡器型： | 内部 |
| 工作温度： | -40°C ~ 85°C |
| 封装/外壳： | 256-LBGA |
| 包装： | 托盘 |
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MCF5441x ColdFire Microprocessor Data Sheet, Rev. 8
Electrical characteristics
Freescale Semiconductor
22
4.2
Thermal characteristics
The average chip-junction temperature (TJ) in C can be obtained from:
Eqn. 1
Where:
TA
= Ambient Temperature, C
QJMA
= Package Thermal Resistance, Junction-to-Ambient, C/W
PD
=PINT + PI/O
PINT
=IDD IVDD, Watts - Chip Internal Power
PI/O
= Power Dissipation on Input and Output Pins — User Determined
For most applications PI/O < PINT and can be ignored. An approximate relationship between PD and TJ (if PI/O is neglected) is:
Eqn. 2
Table 7. Thermal characteristics
Characteristic
Symbol
196
MAPBGA
256
MAPBGA
Unit
Junction to ambient, natural convection1
1
JA and jt parameters are simulated in conformance with EIA/JESD Standard 51-2 for natural convection.
Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting
site (board) temperature, ambient temperature, air flow, power dissipation of other components on the board,
and board thermal resistance.
Single layer
board (1s)2
2 Per JEDEC JESD51-2 with the single layer board horizontal. Board meets JESD51-9 specification.
JA
58
—
Four layer board
(2s2p)2,3
3 Per JEDEC JESD51-6 with the board horizontal.
JA
35
32
C/W
Junction to ambient (@200 ft/min)1, 3
Single layer
board (1s)
JMA
48
—
Four layer board
(2s2p)
JMA
32
29
C/W
Junction to board4
4 Thermal resistance between the die and the printed circuit board in conformance with JEDEC JESD51-8. Board
temperature is measured on the top surface of the board near the package.
JB
22
C/W
Junction to case5
5 Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL
SPEC-883 Method 1012.1).
JC
14
12
C/W
Junction to top of package, natural convection1, 6
6 Thermal characterization parameter indicating the temperature difference between package top and the
junction temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization
parameter is written in conformance with Psi-JT.
jt
32
C/W
Maximum operating junction temperature
Tj
105
oC
TJ
TA
PD JMA
+
=
PD
K
TJ 273C
+
---------------------------------
=
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MCF54418CMJ250 | 制造商:Freescale Semiconductor 功能描述:IC 32-BIT MPU COLDFIRE 250MHZ 256-MA |
| MCF5441X | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:MCF5441x ColdFire Microprocessor Data Sheet |
| MCF54450 | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:ColdFire㈢ Microprocessor |
| MCF54450ACVM180 | 制造商:Freescale Semiconductor 功能描述:MCF5445X RISC 32-BIT 180MHZ 1.8V/2.5V/3.3V 256-PIN MA-BGA BR - Trays 制造商:Freescale Semiconductor 功能描述:MCF5445X V4M CORE, MMU, 制造商:Freescale 功能描述:MPU MCF5445X RISC 32-Bit 180MHz 1.8V/2.5V/3.3V 256-Pin MAP-BGA Brick |
| MCF54450AVM240 | 制造商:Freescale Semiconductor 功能描述:MCF5445X RISC 32-BIT 240MHZ 1.8V/2.5V/3.3V 256-PIN MA-BGA BR - Trays |
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