参数资料
型号: MCF5474ZP266
厂商: Freescale Semiconductor
文件页数: 8/34页
文件大小: 0K
描述: IC MPU 32BIT COLDF 388-PBGA
标准包装: 40
系列: MCF547x
核心处理器: Coldfire V4E
芯体尺寸: 32-位
速度: 266MHz
连通性: EBI/EMI,以太网,I²C,SPI,UART/USART,USB
外围设备: DMA,PWM,WDT
输入/输出数: 99
程序存储器类型: ROMless
RAM 容量: 32K x 8
电压 - 电源 (Vcc/Vdd): 1.43 V ~ 1.58 V
振荡器型: 外部
工作温度: 0°C ~ 70°C
封装/外壳: 388-BBGA
包装: 托盘
MCF547x ColdFire Microprocessor, Rev. 4
SDRAM Bus
Freescale Semiconductor
16
Table 11. SDR Timing Specifications
Symbol
Characteristic
Min
Max
Unit
Notes
Frequency of Operation
0
133
Mhz
1
1 The frequency of operation is 2x or 4x the CLKIN frequency of operation. The MCF547X supports a single external reference
clock (CLKIN). This signal defines the frequency of operation for FlexBus and PCI, but SDRAM clock operates at the same
frequency as the internal bus clock. Please see the PLL chapter of the MCF547X Reference Manual for more information on
setting the SDRAM clock rate.
SD1
Clock Period (tCK)7.52
12
ns
2
2 SDCLK is one SDRAM clock in (ns).
SD2
Clock Skew (tSK)TBD
SD3
Pulse Width High (tCKH)
0.45
0.55
SDCLK
3
3 Pulse width high plus pulse width low cannot exceed min and max clock period.
SD4
Pulse Width Low (tCKL)
0.45
0.55
SDCLK
4
4 Pulse width high plus pulse width low cannot exceed min and max clock period.
SD5
Address, CKE, CAS, RAS, WE, BA, CS - Output Valid (tCMV)0.5 × SDCLK +
1.0ns
ns
SD6
Address, CKE, CAS, RAS, WE, BA, CS - Output Hold (tCMH)2.0
ns
SD7
SDRDQS Output Valid (tDQSOV)Self timed
ns
5
5 SDR_DQS is designed to pulse 0.25 clock before the rising edge of the memory clock. This is a guideline only. Subtle
variation from this guideline is expected. SDR_DQS only pulses during a read cycle and one pulse occurs for each data beat.
SD8
SDDQS[3:0] input setup relative to SDCLK (tDQSIS)0.25 × SDCLK 0.40 × SDCLK
ns
6
6 SDR_DQS is designed to pulse 0.25 clock before the rising edge of the memory clock. This spec is a guideline only. Subtle
variation from this guideline is expected. SDR_DQS only pulses during a read cycle and one pulse occurs for each data beat.
SD9
SDDQS[3:0] input hold relative to SDCLK (tDQSIH)
Does not apply. 0.5 SDCLK fixed width.
7
7 The SDR_DQS pulse is designed to be 0.5 clock in width. The timing of the rising edge is most important. The falling edge
does not affect the memory controller.
SD10
Data Input Setup relative to SDCLK (reference only) (tDIS)0.25 × SDCLK
ns
8
8 Because a read cycle in SDR mode uses the DQS circuit within the MCF547X, it is most critical that the data valid window
be centered 1/4 clk after the rising edge of DQS. Ensuring that this happens results in successful SDR reads. The input setup
spec is provided as guidance.
SD11
Data Input Hold relative to SDCLK (reference only) (tDIH)1.0
ns
SD12
Data and Data Mask Output Valid (tDV)0.75 × SDCLK
+0.500ns
ns
SD13
Data and Data Mask Output Hold (tDH)1.5
ns
相关PDF资料
PDF描述
MCF5272CVM66J IC MCU 32BIT 66MHZ 196-MAPBGA
MC9S12XDP512MAG IC MCU 512K FLASH 144-LQFP
MC9S12XEP100MAG IC MCU 16BIT 1M FLASH 144-LQFP
V24C15M100BL2 CONVERTER MOD DC/DC 15V 100W
MS3111E8-4PW CONN RCPT 4POS CBL MNT W/PINS
相关代理商/技术参数
参数描述
MCF5475 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:MCF547x Integrated Microprocessor Electrical Characteristics
MCF5475EC 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:MCF547x ColdFire Microprocessor
MCF5475VR200 功能描述:微处理器 - MPU MCF547X V4ECORE MMU FPU RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
MCF5475VR266 功能描述:微处理器 - MPU MCF547X V4ECORE MMU FPU RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
MCF5475ZP200 功能描述:微处理器 - MPU MCF547X V4ECORE MMU FPU RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324