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参数资料
| 型号： | MCIMX233CJM4C |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 1/2页 |
| 文件大小： | 0K |
| 描述： | MPU 32BIT I.MX233 IND 169MAPBGA |
| 标准包装： | 176 |
| 系列： | i.MX23 |
| 核心处理器： | ARM9 |
| 芯体尺寸： | 32-位 |
| 速度： | 454MHz |
| 连通性： | EBI/EMI，I²C，MMC，智能卡，SPI，SSI，UART/USART，USB |
| 外围设备： | DMA，I²S，LCD，POR，PWM，WDT |
| 输入/输出数： | 95 |
| 程序存储器容量： | 64KB（16K x 32） |
| 程序存储器类型： | ROM |
| RAM 容量： | 8K x 32 |
| 电压 - 电源 (Vcc/Vdd)： | 1 V ~ 2.1 V |
| 数据转换器： | A/D 16x12b，D/A 1x10b |
| 振荡器型： | 外部 |
| 工作温度： | -40°C ~ 85°C |
| 封装/外壳： | 169-LFBGA |
| 包装： | 托盘 |
Consumer and Industrial/General Embedded Market
i.MX233 Applications Processor
32-bit Embedded Microprocessor – ARM
Overview
The i.MX233 applications processor extends
Freescale’s ARM9 portfolio and introduces
several unique features such as power
management, analog audio, 12-bit ADC’s and
a touch screen controller that allows customers
to eliminate external components, reducing
their overall system bill of materials cost. The
i.MX233 integrates industry-leading power
management technology to manage the power
sequencing required by the processor itself
and supplies power to other components in
the system, such as external memories, from
a single Li-Ion battery. Additionally, analog
audio features such as the stereo ADC/DAC
and amplifiers, plus a mono speaker amplifier
provide a complete solution in a single device
for multimedia applications. Furthermore, many
consumer applications require a rich graphical
user interface which is supported with the LCD
touch screen controller and basic hardware
graphics acceleration with the pixel pipeline
processor.
The i.MX233 is offered in two packages to
provide more tailored options for the various
target applications. The 169 BGA package
provides access to all of the features of the
i.MX233. The 128 LQFP package provides
a subset of these features in order to fit into
the smaller pin count package. This smaller
package option is ideal for cost-sensitive entry
level applications that use small displays, don't
require touchscreen user interface and have
manufacturing restrictions (number of board
layers). The feature differences are shown in the
block diagram and table.
Target applications
PortableMediaPlayers
PortableNavigationDevices
HomeAppliances
GraphicalRemoteControls
HomeAutomation
eBooks
DigitalPictureFrames
Audioperipheralsandaccessories
VoIPHandsets
Simplehumanmachineinterface(HMI)
panels for industrial applications
Key Features
CPU
ARM926EJ-Srunsupto454MHz
16KBI&DL1Cache
Power Management
IntegratedDC-DCconverterwithmultiple
channel outputs
SupportsLi-Ionbatteries
Directpowerfrom5Vsource(USB,wall
power or other source)
Batterychargingcapability
On-chipsiliconspeedandtempsensors
Connectivity
High-SpeedUSBHost/Devicewith
integratedPHY
UART
Serialperipheralinterfaces(SPI)
12-bitLow-ResolutionADC(LRADC)
3.3VgeneralpurposeI/O
Multimedia and Graphics Processing
Displaycontrolleroptimizedforupto
24-bit-per-pixelVGA(640x480)resolution
Pixelprocessingpipeline(PXP)tohandle
post display frame pre-processing in
hardware with minimal memory overhead
TVEncoderand10-bitVideoDACout
Memory
Internal32KBSRAM
SupportforexternalDDR1,mDDR
SupportforexternalNANDwithhardware
errorcorrection(20-bitBCHor8-bit
ReedSolomon)
SupportforexternalmanagedNANDs
viaSDIO
Audio
StereoanalogaudioADC/DAC
Stereoheadphoneamplifier
1.5Wmonospeakeramplifieroutput
S/PDIFdigitaloutput
SerialAudioInterface(I2S)
Benefits
CPU Performance and Low Power
454MHzARM9CPUwithampleheadroom
for many consumer and embedded
applications without sacrificing battery life.
For plugged in “always on” devices, the low
power consumption of the i.MX233
can improve energy efficiency.
Simplified Development
The integration of mixed-signal analog such
as power management, analog audio and
A/D channels reduces system complexity
and speeds time-to-market. In addition, an
imageprocessingunitsupporting24-bitVGA
displays is integrated to provide rich user
interfaces.Withawiderangeofconnectivity
options,suchasUART,SDIO,USBandI2C,
the i.MX233 processor provides the ability to
connect wirelessly to other devices, through
the use of off-chip Bluetooth,Wi-Fiandother
wireless protocols.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MCIMX233CJM4CR2 | 功能描述:处理器 - 专门应用 i.MX233 Industrial RoHS:否 制造商:Freescale Semiconductor 类型:Multimedia Applications 核心:ARM Cortex A9 处理器系列:i.MX6 数据总线宽度:32 bit 最大时钟频率:1 GHz 指令/数据缓存: 数据 RAM 大小:128 KB 数据 ROM 大小: 工作电源电压: 最大工作温度:+ 95 C 安装风格:SMD/SMT 封装 / 箱体:MAPBGA-432 |
| MCIMX233CVM4B | 功能描述:处理器 - 专门应用 PMP CONTROLLER RoHS:否 制造商:Freescale Semiconductor 类型:Multimedia Applications 核心:ARM Cortex A9 处理器系列:i.MX6 数据总线宽度:32 bit 最大时钟频率:1 GHz 指令/数据缓存: 数据 RAM 大小:128 KB 数据 ROM 大小: 工作电源电压: 最大工作温度:+ 95 C 安装风格:SMD/SMT 封装 / 箱体:MAPBGA-432 |
| MCIMX233DAG4B | 功能描述:处理器 - 专门应用 PMP CONTROLLER RoHS:否 制造商:Freescale Semiconductor 类型:Multimedia Applications 核心:ARM Cortex A9 处理器系列:i.MX6 数据总线宽度:32 bit 最大时钟频率:1 GHz 指令/数据缓存: 数据 RAM 大小:128 KB 数据 ROM 大小: 工作电源电压: 最大工作温度:+ 95 C 安装风格:SMD/SMT 封装 / 箱体:MAPBGA-432 |
| MCIMX233DAG4C | 功能描述:处理器 - 专门应用 i.MX233 Commercial RoHS:否 制造商:Freescale Semiconductor 类型:Multimedia Applications 核心:ARM Cortex A9 处理器系列:i.MX6 数据总线宽度:32 bit 最大时钟频率:1 GHz 指令/数据缓存: 数据 RAM 大小:128 KB 数据 ROM 大小: 工作电源电压: 最大工作温度:+ 95 C 安装风格:SMD/SMT 封装 / 箱体:MAPBGA-432 |
| MCIMX233DJM4B | 功能描述:处理器 - 专门应用 I.MX233 COMMERCIAL RoHS:否 制造商:Freescale Semiconductor 类型:Multimedia Applications 核心:ARM Cortex A9 处理器系列:i.MX6 数据总线宽度:32 bit 最大时钟频率:1 GHz 指令/数据缓存: 数据 RAM 大小:128 KB 数据 ROM 大小: 工作电源电压: 最大工作温度:+ 95 C 安装风格:SMD/SMT 封装 / 箱体:MAPBGA-432 |
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