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参数资料
| 型号： | MCM500VKIT2 |
| 厂商： | Cornell Dubilier Electronics (CDE) |
| 文件页数： | 6/7页 |
| 文件大小： | 0K |
| 描述： | KIT METAL CLAD 10PF-1000PF 500V |
| 标准包装： | 1 |
| 系列： | MCM |
| 套件类型： | 云母 |
| 值： | 50 件 - 10pF ~ 1000pF，各 5 件 |
| 包装： | 带装箱指南的塑料箱 |
| 安装类型： | 表面贴装 |
| 包括封装： | 非标准型 SMD |
| 工具箱内容： | (5) 338-1363-ND - CAP MICA 68PF 500V 5% SMD (5) 338-1362-ND - CAP MICA 33PF 500V 5% SMD (5) 338-1324-ND - CAP MICA 1000PF 500V 5% SMD (5) 338-1321-ND - CAP MICA 470PF 500V 5% SMD (5) 338-1320-ND - CAP MICA 330PF 500V 5% SMD (5) 338-1319-ND - CAP MICA 220PF 500V 5% SMD (5) 338-1317-ND - CAP MICA 100PF 500V 5% SMD (5) 338-1316-ND - CAP MICA 47PF 500V 5% SMD (5) 338-1314-ND - CAP MICA 15PF 500V 5% SMD (5) 338-1313-ND - CAP MICA 10PF 500V 5% SMD |
| 其它名称： | 338-1358 |
Tape Specifications
Types MCM and MIN SMT Clad RF Capacitors
Standard Minimum Quantities
Bulk Pack : 100 pieces per bag Reel Pack: 500 pieces per reel
Tape Dimensions (mm)
Case
MIN02-002
< 150 pF
MIN02-002
≥ 150 pF
W
16
16
A
5.56
5.66
B
8.18
8.10
P1
8
8
F
7.5
7.5
t
2.16
3.20
Note: 24 mm tape for MCM01-009 and 32 mm tape for MCM01-004 are available upon request.
Solder Profile
300
Reflow Soldering Method
Specifications:
Lead free finish
Case and Terminal Material:
Silver plated, copper flashed, brass
260
200
150
100
220 - 260 oC
Peak 230 - 260 oC
10 sec. max.
50
Pre-Heat
Soldering
Cooling
0
30
50
150
190
200
Time (seconds)
300
250
200
150
100
50
Wave Soldering Method
Peak 230 - 260 oC
220 - 260 oC
5 sec.
max.
0
0
Pre-Heat
20
70
Soldering Cooling
80
Time (seconds)
90
6
CDE Cornell Dubilier ? 1605 E. Rodney French Blvd. ? New Bedford, MA 02744 ? Phone: (508)996-8561 ? Fax: (508)996-3830 ? www.cde.com
7-9-2008 fixed
graphs
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