参数资料
型号: MCP120T-450I/SN
厂商: Microchip Technology
文件页数: 9/16页
文件大小: 0K
描述: IC SUPRVSR 4.50V OPN DRAIN 8SOIC
标准包装: 3,300
类型: 简单复位/加电复位
监视电压数目: 1
输出: 开路漏极或开路集电极
复位: 低有效
复位超时: 最小为 150 ms
电压 - 阀值: 4.375V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 8-SOIC(0.154",3.90mm 宽)
供应商设备封装: 8-SOICN
包装: 带卷 (TR)
MCP120/130
8-Lead Plastic Small Outline (SN) – Narrow, 150 mil (SOIC
E
E1
p
D
2
B
n
1
c
45 °
h
φ
A
α
A2
β
Units
L
INCHES*
A1
MILLIMETERS
Dimension Limits
MIN
NOM
MAX
MIN
NOM
MAX
Number of Pins
Pitch
n
p
8
.050
8
1.27
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Overall Length
Chamfer Distance
Foot Length
A
A2
A1
E
E1
D
h
L
.053
.052
.004
.228
.146
.189
.010
.019
.061
.056
.007
.237
.154
.193
.015
.025
.069
.061
.010
.244
.157
.197
.020
.030
1.35
1.32
0.10
5.79
3.71
4.80
0.25
0.48
1.55
1.42
0.18
6.02
3.91
4.90
0.38
0.62
1.75
1.55
0.25
6.20
3.99
5.00
0.51
0.76
Foot Angle
φ
0
4
8
0 4
8
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
c
B
α
β
.008
.013
0
0
.009
.017
12
12
.010
.020
15
15
0.20
0.33
0
0
0.23
0.42
12
12
0.25
0.51
15
15
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010 ” (0.254mm) per side.
JEDEC Equivalent: MS-012
Drawing No. C04-057
? 2001 Microchip Technology Inc.
DS11184D-page 9
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