参数资料
型号: MCP130T-475I/SN
厂商: Microchip Technology
文件页数: 8/16页
文件大小: 0K
描述: IC SUPRVSR 5K PULLUP 4.75V 8SOIC
标准包装: 3,300
类型: 简单复位/加电复位
监视电压数目: 1
输出: 开路漏极或开路集电极
复位: 低有效
复位超时: 最小为 150 ms
电压 - 阀值: 4.625V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 8-SOIC(0.154",3.90mm 宽)
供应商设备封装: 8-SOICN
包装: 带卷 (TR)
MCP120/130
3-Lead Plastic Small Outline Transistor (TT) (SOT23)
E
E1
2
B
n
p
p1
D
1
α
c
A
A2
φ
A1
β
L
Units
INCHES*
MILLIMETERS
Dimension Limits
MIN
NOM
MAX
MIN
NOM
MAX
Number of Pins
Pitch
Outside lead pitch (basic)
n
p
p1
3
.038
.076
3
0.96
1.92
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Overall Length
Foot Length
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
A
A2
A1
E
E1
D
L
φ
c
B
α
β
.035
.035
.000
.083
.047
.110
.014
0
.004
.015
0
0
.040
.037
.002
.093
.051
.115
.018
5
.006
.017
5
5
.044
.040
.004
.104
.055
.120
.022
10
.007
.020
10
10
0.89
0.88
0.01
2.10
1.20
2.80
0.35
0
0.09
0.37
0
0
1.01
0.95
0.06
2.37
1.30
2.92
0.45
5
0.14
0.44
5
5
1.12
1.02
0.10
2.64
1.40
3.04
0.55
10
0.18
0.51
10
10
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010 ” (0.254mm) per side.
JEDEC Equivalent: TO-236
Drawing No. C04-104
DS11184D-page 8
? 2001 Microchip Technology Inc.
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