参数资料
型号: MCP1602T-180I/MF
厂商: Microchip Technology
文件页数: 19/26页
文件大小: 0K
描述: IC REG BUCK SYNC 1.8V 0.5A 8DFN
标准包装: 3,300
类型: 降压(降压)
输出类型: 固定
输出数: 1
输出电压: 1.8V
输入电压: 2.7 V ~ 5.5 V
频率 - 开关: 2MHz
电流 - 输出: 500mA
同步整流器:
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 8-VDFN 裸露焊盘
包装: 带卷 (TR)
供应商设备封装: 8-DFN-EP(3x3)
其它名称: MCP1602T-180I/MFTR
MCP1602
8-Lead Plastic Dual Flat, No Lead Package (MF) – 3x3x0.9 mm Body [DFN]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
N
D
b
e
N
L
EXPOSED PAD
E
K
E2
NOTE 1
1
2
D2
2
1
NOTE 1
A 3
TOP VIEW
A1
A
NOTE 2
BOTTOM VIEW
Units
MILLIMETERS
Number of Pins
Pitch
Dimension Limits
N
e
MIN
NOM
8
0.65 BSC
MAX
Overall Height
Standoff
Contact Thickness
Overall Length
Exposed Pad Width
Overall Width
Exposed Pad Length
Contact Width
Contact Length
A
A1
A3
D
E2
E
D2
b
L
0.80
0.00
0.00
0.00
0.25
0.20
0.90
0.02
0.20 REF
3.00 BSC
3.00 BSC
0.30
0.30
1.00
0.05
1.60
2.40
0.35
0.55
Contact-to-Exposed Pad K 0.20 –
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package may have one or more exposed tie bars at ends.
3. Package is saw singulated.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-062B
? 2007 Microchip Technology Inc.
DS22061A-page 19
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