参数资料
型号: MCP1603-150I/MC
厂商: Microchip Technology
文件页数: 20/26页
文件大小: 0K
描述: IC REG BUCK SYNC 1.5V 0.5A 8DFN
标准包装: 150
类型: 降压(降压)
输出类型: 固定
输出数: 1
输出电压: 1.5V
输入电压: 2.7 V ~ 5.5 V
PWM 型: 电流模式
频率 - 开关: 2MHz
电流 - 输出: 500mA
同步整流器:
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 8-VFDFN 裸露焊盘
包装: 管件
供应商设备封装: 8-DFN(3x2)
配用: MCP1603RD-TNY-ND - REFERENCE DESIGN FOR MCP1603
MCP1603EV-ND - BOARD EVAL BUCK CONV MCP1603
MCP1603
5-Lead Plastic Thin Small Outline Transistor (OS) [TSOT]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
N
b
E1
E
NOTE 1
1
2
3
e
e 1
D
α
A
A1
A2
Units
c
β
MILLIMETERS
L
L1
φ
Number of Leads
Lead Pitch
Outside Lead Pitch
Dimension Limits
N
e
e1
MIN
NOM
5
0.95 BSC
1.90 BSC
MAX
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Foot Length
Footprint
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
A
A2
A1
E
E1
D
L
L1
φ
c
b
α
β
0.70
0.00
0.30
0.08
0.30
0.90
2.80 BSC
1.60 BSC
2.90 BSC
0.45
0.60 REF
10°
10°
1.10
1.00
0.10
0.60
0.20
0.50
12°
12°
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
3. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-128B
DS22042A-page 20
? 2007 Microchip Technology Inc.
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