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参数资料
| 型号： | MCP1603-250I/MC |
| 厂商： | Microchip Technology |
| 文件页数： | 11/26页 |
| 文件大小： | 0K |
| 描述： | IC REG BUCK SYNC 2.5V 0.5A 8DFN |
| 标准包装： | 150 |
| 类型： | 降压（降压） |
| 输出类型： | 固定 |
| 输出数： | 1 |
| 输出电压： | 2.5V |
| 输入电压： | 2.7 V ~ 5.5 V |
| PWM 型： | 电流模式 |
| 频率 - 开关： | 2MHz |
| 电流 - 输出： | 500mA |
| 同步整流器： | 是 |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 8-VFDFN 裸露焊盘 |
| 包装： | 管件 |
| 供应商设备封装： | 8-DFN（3x2） |
| 配用： | MCP1603RD-TNY-ND - REFERENCE DESIGN FOR MCP1603 MCP1603EV-ND - BOARD EVAL BUCK CONV MCP1603 |
MCP1603
3.0
PIN DESCRIPTIONS
TABLE 3-1:
PIN FUNCTION TABLE
Pin No.
Description
MCP1603
TSOT23
MCP1603L
TSOT23
2x3 DFN
Symbol
1
2
3
4
5
—
—
4
2
1
5
3
—
—
7
8
3
4
1
2, 5, 6
Exposed
V IN
GND
SHDN
V FB /V OUT
L X
NC
EP
Power Supply Input Voltage Pin
Ground Pin
Shutdown Control Input Pin
Feedback / Output Voltage Pin
Switch Node, Buck Inductor Connection Pin
No Connect
For the DFN package, the center exposed pad is a thermal
Pad
path to remove heat from the device. Electrically this pad is at
ground potential and should be connected to GND
3.1
Power Supply Input Voltage Pin
3.4
Feedback / Output Voltage Pin
(V IN )
Connect the input voltage source to V IN . The input
source must be decoupled to GND with a 4.7 μF
capacitor.
(V FB /V OUT )
For adjustable output options, connect the center of the
output voltage divider to the V FB /V OUT pin. For fixed-
output voltage options, connect the output directly to
3.2
Ground Pin (GND)
the V FB /V OUT pin.
Ground pin for the device. The loop area of the ground
traces should be kept as minimal as possible.
3.5
Switch Node, Buck Inductor
Connection Pin (L X )
3.3
Shutdown Control Input Pin
(SHDN)
Connect the L X pin directly to the buck inductor. This
pin carries large signal-level current; all connections
should be made as short as possible.
The SHDN pin is a logic-level input used to enable or
disable the device. A logic high (> 45% of V IN ) will
enable the regulator output. A logic-low (< 15% of V IN )
will ensure that the regulator is disabled.
? 2007 Microchip Technology Inc.
3.6 Exposed Metal Pad (EP)
For the DFN package, connect the Exposed Pad to
GND, with vias into the GND plane. This connection to
the GND plane will aid in heat removal from the
package.
DS22042A-page 11
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