参数资料
型号: MCP1702-2802E/TO
厂商: Microchip Technology
文件页数: 4/26页
文件大小: 0K
描述: IC REG LDO 2.8V .25A TO92-3
标准包装: 1,000
稳压器拓扑结构: 正,固定式
输出电压: 2.8V
输入电压: 最高 13.2V
电压 - 压降(标准): 0.625V @ 250mA
稳压器数量: 1
电流 - 输出: 250mA(最小)
工作温度: -40°C ~ 125°C
安装类型: 通孔
封装/外壳: TO-226-3、TO-92-3 标准主体
供应商设备封装: TO-92-3
包装: 散装
产品目录页面: 667 (CN2011-ZH PDF)
MCP1702
DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise specified, all limits are established for V IN = V OUT(MAX) + V DROPOUT(MAX) , Note 1 ,
I LOAD = 100 μA, C OUT = 1 μF (X7R), C IN = 1 μF (X7R), T A = +25°C.
Boldface type applies for junction temperatures, T J of -40°C to +125°C. ( Note 7 )
Parameters
Dropout Voltage
Sym
V DROPOUT
Min
Typ
330
525
625
750
Max
650
725
975
1100
Units
mV
mV
mV
mV
mV
Conditions
I L = 250 mA, V R = 5.0V
I L = 250 mA, 3.3V ? V R < 5.0V
I L = 250 mA, 2.8V ? V R < 3.3V
I L = 250 mA, 2.5V ? V R < 2.8V
V R < 2.5V, See Maximum Output
Current Parameter
Output Delay Time
T DELAY
1000
μs
V IN = 0V to 6V, V OUT = 90% V R
R L = 50 ? resistive
Output Noise
e N
8
μV/(Hz) 1/2 I L = 50 mA, f = 1 kHz, C OUT = 1 μF
Power Supply Ripple
PSRR
44
dB
f = 100 Hz, C OUT = 1 μF, I L = 50 mA,
Rejection Ratio
V INAC = 100 mV pk-pk, C IN = 0 μF,
V R = 1.2V
Thermal Shutdown
T SD
150
°C
Protection
Note 1:
2:
3:
4:
5:
6:
7:
The minimum V IN must meet two conditions: V IN ??? 2.7V and V IN ??? V OUT(MAX) + V DROPOUT(MAX) .
V R is the nominal regulator output voltage. For example: V R = 1.2V, 1.5V, 1.8V, 2.5V, 2.8V, 3.0V, 3.3V, 4.0V, or 5.0V. The
input voltage V IN = V OUT(MAX) + V DROPOUT(MAX) or V IN = 2.7V (whichever is greater); I OUT = 100 μA.
TCV OUT = (V OUT-HIGH - V OUT-LOW ) *10 6 / (V R * ? Temperature), V OUT-HIGH = highest voltage measured over the
temperature range. V OUT-LOW = lowest voltage measured over the temperature range.
Load regulation is measured at a constant junction temperature using low duty cycle pulse testing. Changes in output
voltage due to heating effects are determined using thermal regulation specification TCV OUT .
Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its measured
value with an applied input voltage of V OUT(MAX) + V DROPOUT(MAX) or 2.7V, whichever is greater.
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction
temperature and the thermal resistance from junction to air (i.e., T A , T J , ? JA ). Exceeding the maximum allowable power
dissipation will cause the device operating junction temperature to exceed the maximum 150°C rating. Sustained
junction temperatures above 150°C can impact the device reliability.
The junction temperature is approximated by soaking the device under test at an ambient temperature equal to the
desired Junction temperature. The test time is small enough such that the rise in the Junction temperature over the
ambient temperature is not significant.
DS22008E-page 4
? 2010 Microchip Technology Inc.
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