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| 型号： | MCP1702T-2302E/CB |
| 厂商： | Microchip Technology |
| 文件页数： | 14/26页 |
| 文件大小： | 0K |
| 描述： | IC REG LDO 2.3V 50MA SOT-23-3 |
| 标准包装： | 3,000 |
| 稳压器拓扑结构： | 正，固定式 |
| 输出电压： | 2.3V |
| 输入电压： | 2.7 V ~ 13.2 V |
| 稳压器数量： | 1 |
| 电流 - 输出： | 50mA（最小） |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | TO-236-3，SC-59，SOT-23-3 |
| 供应商设备封装： | SOT-23A-3 |
| 包装： | 带卷 (TR) |
MCP1702
6.0
APPLICATION CIRCUITS AND
ISSUES
EQUATION 6-2:
T J ? MAX ? = P TOTAL ? R ? JA + T AMAX
6.1
Typical Application
Where:
T J(MAX)
=
Maximum continuous junction
The MCP1702 is most commonly used as a voltage
temperature
regulator. Its low quiescent current and low dropout
voltage makes it ideal for many battery-powered
applications.
MCP1702
P TOTAL
R ? JA
T AMAX
=
=
Total device power dissipation
Thermal resistance from
junction to ambient
Maximum ambient temperature
V OUT
1.8V
I OUT
150 mA
GND
V OUT
C OUT
1 μF Ceramic
V IN
V IN
(2.8V to 3.2V)
C IN
1 μF Ceramic
The maximum power dissipation capability for a
package can be calculated given the junction-to-
ambient thermal resistance and the maximum ambient
temperature for the application. The following equation
can be used to determine the package maximum
internal power dissipation.
FIGURE 6-1:
Typical Application Circuit.
EQUATION 6-3:
R ? JA
6.1.1
APPLICATION INPUT CONDITIONS
Package Type = SOT-23A
Where:
? T J ? MAX ? – T A ? MAX ? ?
P D ? MAX ? = ---------------------------------------------------
Input Voltage Range = 2.8V to 3.2V
V IN maximum = 3.2V
V OUT typical = 1.8V
I OUT = 150 mA maximum
P D(MAX)
T J(MAX)
=
=
Maximum device power
dissipation
Maximum continuous junction
temperature
6.2
6.2.1
Power Calculations
POWER DISSIPATION
T A(MAX)
R ? JA
=
Maximum ambient temperature
Thermal resistance from
junction to ambient
The internal power dissipation of the MCP1702 is a
function of input voltage, output voltage and output
current. The power dissipation, as a result of the
quiescent current draw, is so low, it is insignificant
(2.0 μA x V IN ). The following equation can be used to
calculate the internal power dissipation of the LDO.
EQUATION 6-4:
T J ? RISE ? = P D ? MAX ? ? R ? JA
Where:
EQUATION 6-1:
T J(RISE)
=
Rise in device junction
temperature over the ambient
P LDO = ? V IN ? MAX ? ? – V OUT ? MIN ? ? ? I OUT ? MAX ? ?
Where:
P TOTAL
=
temperature
Maximum device power
dissipation
P LDO
V IN(MAX)
V OUT(MIN)
=
=
=
LDO Pass device internal
power dissipation
Maximum input voltage
LDO minimum output voltage
R ? JA
EQUATION 6-5:
Thermal resistance from
junction to ambient
T J = T J ? RISE ? + T A
The maximum continuous operating junction
temperature specified for the MCP1702 is +125 ° C . To
Where:
estimate the internal junction temperature of the
MCP1702, the total internal power dissipation is
multiplied by the thermal resistance from junction to
ambient (R ? JA ). The thermal resistance from junction to
ambient for the SOT-23A pin package is estimated at
336 ° C/W.
DS22008E-page 14
T J
T J(RISE)
T A
=
=
Junction Temperature
Rise in device junction
temperature over the ambient
temperature
Ambient temperature
? 2010 Microchip Technology Inc.
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