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| 型号： | MCP1790T-5002E/DB |
| 厂商： | Microchip Technology |
| 文件页数： | 5/34页 |
| 文件大小： | 0K |
| 描述： | IC REG LDO 5V 70MA SOT-223-3 |
| 标准包装： | 4,000 |
| 稳压器拓扑结构： | 正，固定式 |
| 输出电压： | 5V |
| 输入电压： | 6 V ~ 30 V |
| 电压 - 压降（标准）： | 0.7V @ 70mA |
| 稳压器数量： | 1 |
| 电流 - 输出： | 70mA（最小） |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | TO-261-4，TO-261AA |
| 供应商设备封装： | SOT-223-3 |
| 包装： | 带卷 (TR) |
| 其它名称： | MCP1790T-5002E/DBTR |
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MCP1790/MCP1791
AC/DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise noted, V IN = V OUT(MAX) + V DROPOUT(MAX), (Note 1) , I OUT = 1 mA,
C OUT = 4.7 μF (X7R Ceramic), C IN = 4.7 μF (X7R Ceramic), T A = +25°C, SHDN > 2.4V.
Boldface type applies for junction temperatures, T J (Note 5) of -40°C to +125°C.
Parameters
Short Circuit Foldback Voltage Corner
Short Circuit Foldback Current
Startup Voltage Overshoot
Dropout Voltage
Dropout Current
I OUT = 0 mA
Symbol
V FOLDBACK
V OVER
V DROPOUT
I DO
Min
—
—
—
—
—
—
—
—
—
—
—
Typ
4.2
3.0
2.7
105
99
99
0.10
700
130
75
75
Max
—
—
—
—
—
—
—
1300
—
—
—
Units
V
V
V
mA
mA
mA
% V OUT
mV
μA
μA
μA
Conditions
V R = 5.0V
Falling V OUT, R LOAD < 0.1 Ω
V R = 3.3V
Falling V OUT, R LOAD < 0.1 Ω
V R = 3.0V
Falling V OUT, R LOAD < 0.1 Ω
V OUT ~= 0V,
R LOAD < 0.1 Ω,
V IN = 0V to 6.0V
V R = 5.0V, V IN = 4.500V
V R = 3.3V, V IN = 4.500V
V R = 3.0V, V IN = 4.500V
Shutdown Input
Logic High Input
Logic Low Input
Shutdown Input Leakage Current
V SHDN-HIGH
V SHDN-LOW
SHDN ILK
2.4
0
—
—
—
—
0.100
3.0
V IN(MAX)
0.8
0.500
5.0
V
V
μA
—
—
SHDN = GND
SHDN = 6V
Power Good Characteristics
PWRGD Input Voltage Operating
Range
PWRGD Threshold Voltage
(Referenced to V OUT )
PWRGD Threshold Hysteresis
PWRGD Output Voltage LOW
PWRGD Output Sink Current
PWRGD Leakage
PWRGD Time Delay
V PWRGD_VIN
V PWRGD_TH
V PWRGD_HYS
V PWRGD_L
I PWRGD_L
I PWRGD _ LK
T PG
2.8
88
1.0
—
5.0
—
—
—
90
2.0
0.2
—
1.0
30
—
92
3.0
0.4
—
—
—
V
%V OUT
%V OUT
V
mA
nA
μs
—
Falling Edge of V OUT
Rising Edge of V OUT
I PWRGD SINK = 5.0 mA,
V OUT = 0V
V PWRGD <= 0.4V
V PWRGD = V IN = 6.0V
Rising Edge
Note 1:
2:
3:
4:
5:
6:
7:
8:
9:
The minimum V IN , V IN(MIN) must meet two conditions: V IN ≥ 6.0 V and V IN ≥ V OUT(MAX) + V DROPOUT(MAX).
V R is the nominal regulator output voltage.
Load regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is
tested over a load range from 1 mA to the maximum specified output current.
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction
temperature and the thermal resistance from junction to air. (i.e., T A , T J , θ JA ). Exceeding the maximum allowable power
dissipation will cause the device operating junction temperature to exceed the maximum 165°C rating. Sustained
junction temperatures above 165°C can impact the device reliability.
The junction temperature is approximated by soaking the device under test at an ambient temperature equal to the
desired Junction temperature. The test time is small enough such that the rise in the Junction temperature over the
ambient temperature is not significant.
Dropout voltage is defined as the input-to-output voltage differential at which the output voltage drops 2% below its
nominal value that was measured with an input voltage of V IN = V R + V DROPOUT( MAX ) .
Sustained junction temperatures above 165°C can impact the device reliability.
The Short Circuit Recovery Time test is done by placing the device into a short circuit condition and then removing the
short circuit condition before the device die temperature reaches 125 °C. If the device goes into thermal shutdown, then
the Short Circuit Recovery Time will depend upon the thermal dissipation properties of the package and circuit board.
TCV OUT = (V OUT-HIGH - V OUT-LOW ) *10^6/(V R * Δ Temperature), V OUT-HIGH = highest voltage measured over the temperature
range. V OUT-LOW = lowest voltage measured over the temperature range.
? 2010 Microchip Technology Inc.
DS22075B-page 5
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