参数资料
型号: MCP2004-E/SN
厂商: Microchip Technology
文件页数: 1/34页
文件大小: 0K
描述: IC LIN BUS BIDIRECT 8SOIC
产品培训模块: Microchip MCP20xx LIN Transceiver Overview
标准包装: 100
类型: 收发器
驱动器/接收器数: 1/1
规程: LIN
电源电压: 6 V ~ 27 V
安装类型: 表面贴装
封装/外壳: 8-SOIC(0.154",3.90mm 宽)
供应商设备封装: 8-SOICN
包装: 管件
2010-2011 Microchip Technology Inc.
DS22230D-page 1
MCP2003/4/3A/4A
Features
The MCP2003/2003A and MCP2004/2004A are
compliant with Local Interconnect Network (LIN)
Bus Specifications 1.3, 2.0 and 2.1 and are
compliant to SAE J2602
Support Baud Rates up to 20 Kbaud with
LIN-compatible output driver
43V load dump protected
Very low EMI meets stringent OEM requirements
Very high ESD immunity:
- >20kV on VBB (IEC 61000-4-2)
- >14kV on LBUS (IEC 61000-4-2)
Very high immunity to RF disturbances meets
stringent OEM requirements
Wide supply voltage, 6.0V-27.0V continuous
Extended Temperature Range: -40 to +125°C
Interface to PIC MCU EUSART and standard
USARTs
LIN bus pin:
- Internal pull-up resistor and diode
- Protected against battery shorts
- Protected against loss of ground
- High current drive
Automatic thermal shutdown
Low-power mode:
- Receiver monitoring bus and transmitter off,
(
5A)
Description
This device provides a bidirectional, half-duplex
communication, physical interface to automotive and
industrial LIN systems to meet the LIN bus specification
Revision 2.1 and SAE J2602. The device is short-
circuit and over-temperature protected by internal
circuitry. The device has been specifically designed to
operate in the automotive operating environment and
will survive all specified transient conditions while
meeting
all
of
the
stringent
quiescent
current
requirements.
MCP200X family members:
8-pin PDIP, DFN and SOIC packages:
- MCP2003, LIN-compatible driver, with WAKE
pins, wake up on falling edge of LBUS
- MCP2003A, LIN-compatible driver, with
WAKE pins, wake up on rising edge of LBUS
- MCP2004, LIN-compatible driver, with
FAULT/TXE pins, wake up on falling edge of
LBUS
- MCP2004A, LIN-compatible driver, with
FAULT/TXE pins, wake up on rising edge of
LBUS
Package Types
MCP2004/
2004A
PDIP, SOIC
FAULT/TXE
CS/WAKE
TXD
VBB
LBUS
1
2
3
4
8
7
6
5 VSS
VREN
RXD
MCP2003/
2003A
PDIP, SOIC
WAKE
CS
TXD
VBB
LBUS
1
2
3
4
8
7
6
5 VSS
VREN
RXD
MCP2003/
2003A
4x4 DFN*
WAKE
CS
TXD
VBB
LBUS
1
2
3
4
8
7
6
5 VSS
VREN
RXD
EP
9
MCP2004/
2004A
4x4 DFN*
FAULT/TXE
CS/WAKE
TXD
VBB
LBUS
1
2
3
4
8
7
6
5 VSS
VREN
RXD
EP
9
* Includes Exposed Thermal Pad (EP); see Table 1-1.
LIN J2602 Transceiver
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