参数资料
型号: MCP2021PT-500E/MD
厂商: Microchip Technology
文件页数: 21/52页
文件大小: 0K
描述: IC TXRX LIN ON-BOARD VREG 8DFN
产品培训模块: Microchip MCP20xx LIN Transceiver Overview
标准包装: 3,300
系列: *
MCP2021/2/1P/2P
DS22018F-page 28
2005-2012 Microchip Technology Inc.
2.4
Thermal Specifications
Voltage Regulator
Bus Activity Debounce Time
tBDB
5
10
20
s
Bus debounce time
Bus Activity to Voltage
Regulator Enabled
tBACTVE
100
250
500
s
After bus debounce time
Voltage Regulator Enabled
to Ready
tVEVR
1200
s
Chip Select to Operation
Ready
tCSOR
500
s
Chip Select to Power-Down
tCSPD
——
80
s
Short-Circuit to Shut-Down
tSHUTDOWN
20
100
s
RESET Timing
VREG OK Detect to RESET
Inactive
tRPU
——
10.0
s
VREG OK Detect to RESET
Active
tRPD
——
10.0
s
Note 1:
Time depends on external capacitance and load.
THERMAL CHARACTERISTICS
Parameter
Symbol
Typ
Max
Units
Test Conditions
Recovery Temperature
θRECOVERY
+140
°C
Shutdown Temperature
θSHUTDOWN
+150
°C
Short Circuit Recovery Time
tTHERM
1.5
5.0
ms
Thermal Package Resistances
Thermal Resistance, 8L-DFN
θJA
35.7
°C/W
Thermal Resistance, 8L-PDIP
θJA
89.3
°C/W
Thermal Resistance, 8L-SOIC
θJA
149.5
°C/W
Thermal Resistance, 14L-PDIP
θJA
70
°C/W
Thermal Resistance, 14L-SOIC
θJA
95.3
°C/W
Thermal Resistance, 14L-TSSOP
θJA
100
°C/W
Note 1:
The maximum power dissipation is a function of TJMAX,
ΘJA and ambient temperature T
A. The maximum
allowable power dissipation at an ambient temperature is PD = (TJMAX - TA)
ΘJA. If this dissipation is
exceeded, the die temperature will rise above 150
°C and the MCP2021 will go into thermal shutdown.
2.3
AC Specification (Continued)
AC CHARACTERISTICS
VBB = 6.0V to 18.0V; TA = -40°C to +125°C
Parameter
Sym
Min.
Typ.
Max.
Units
Test Conditions
相关PDF资料
PDF描述
MCP2021PT-330E/MD IC TXRX LIN ON-BOARD VREG 8DFN
MCP2021P-500E/MD IC TXRX LIN ON-BOARD VREG 8DFN
MCP2021P-330E/MD IC TXRX LIN ON-BOARD VREG 8DFN
MCP2021T-500E/MD IC LIN TXRX ON-BOARD VREG 8DFN
MCP2021T-330E/MD IC LIN TXRX ON-BOARD VREG 8DFN
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