参数资料
型号: MCP212XEV-DB
厂商: Microchip Technology
文件页数: 15/50页
文件大小: 0K
描述: BOARD DEMO FOR MCP212X
标准包装: 1
主要目的: 接口,红外线收发器
已用 IC / 零件: MCP2120,MCP2122
已供物品:
Installation and Operation
2.3
GETTING STARTED
This section presents an overview of the following system blocks:
? The MCP212X Developer ’s Daughter Board Hardware
? The MCP212X Developer ’s Daughter Board Firmware
2.3.1
The MCP212X Developer ’s Daughter Board Hardware Overview
The major components for the MCP212X Developer ’s Daughter Board are:
1.
2.
3.
4.
5.
6.
7.
8.
9.
MCP2122 device (U4)
MCP2120 device socket (U1)
Optical transceiver (U5 – Vishay TFDU 4300)
Headers H1 and H2
Header H3
Header HD1
Jumpers to route the TX, RX and 16XCLK signals
Jumpers to select the baud rate and mode
Footprint for two different optional optical transceiver circuits
(Vishay TFDU 4100 and Agilent HSDL 3000)
10. MCP2120 crystal (Y2)
The MCP212X Developer’s Daughter Board is assembled and tested to allow for the
evaluation and demonstration of the MCP2122 or MCP2120 features. A schematic of the
circuit, as well as the corresponding PCB layout, is shown in Appendix A. “Schematic
and Layouts” . Appendix B. “Bill of Materials (BOM)” shows two tables; the first is the
components that are installed, while the second lists the optional components that are not
installed.
The component layout floor plan is shown in Figure 2-1.
? 2005 Microchip Technology Inc.
DS51571A-page 11
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