参数资料
型号: MCP23017-E/SS
厂商: Microchip Technology
文件页数: 1/48页
文件大小: 0K
描述: IC I/O EXPANDER I2C 16B 28SSOP
产品培训模块: GPIO Expanders
标准包装: 47
接口: I²C
输入/输出数: 16
中断输出:
频率 - 时钟: 1.7MHz
电源电压: 1.8 V ~ 5.5 V
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 28-SSOP(0.209",5.30mm 宽)
供应商设备封装: 28-SSOP
包装: 管件
产品目录页面: 684 (CN2011-ZH PDF)
配用: MCP23X17EV-ND - BOARD EVAL FOR MCP23X17
GPIODM-KPLCD-ND - BOARD DEMO LCD GPIO EXP KEYPAD
2007 Microchip Technology Inc.
DS21952B-page 1
MCP23017/MCP23S17
Features
16-bit remote bidirectional I/O port
- I/O pins default to input
High-speed I2C interface (MCP23017)
- 100 kHz
- 400 kHz
-1.7 MHz
High-speed SPI interface (MCP23S17)
- 10 MHz (max.)
Three hardware address pins to allow up to eight
devices on the bus
Configurable interrupt output pins
- Configurable as active-high, active-low or
open-drain
INTA and INTB can be configured to operate
independently or together
Configurable interrupt source
- Interrupt-on-change from configured register
defaults or pin changes
Polarity Inversion register to configure the polarity
of the input port data
External Reset input
Low standby current: 1 A (max.)
Operating voltage:
- 1.8V to 5.5V @ -40°C to +85°C
- 2.7V to 5.5V @ -40°C to +85°C
- 4.5V to 5.5V @ -40°C to +125°C
Packages
28-pin PDIP (300 mil)
28-pin SOIC (300 mil)
28-pin SSOP
28-pin QFN
Package Types
QFN
2
3
4
5
6
1
7
VSS
NC
15
16
17
18
19
20
21
GPA4
GPA3
GPA2
GPA1
GPA0
VDD
INTB
SCL
SDA
NC
A0
A1
A2
RE
SET
23
24
25
26
27
28
22
G
PB3
G
PB2
G
PB1
G
PB0
GP
A
7
GP
A
6
GP
A
5
1011
8 9
121314
MCP23017
GPB5
GPB6
GPB7
GPB4
INTA
GPB0
GPB1
GPB2
GPB3
INTA
GPB4
NC
GPB5
GPB6
GPB7
SCL
GPA7
GPA6
GPA5
GPA4
GPA3
GPA2
GPA1
GPA0
VDD
VSS
A2
A1
A0
SDA
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
PDIP,
MCP2
3017
INTB
RESET
SSOP
SOIC,
GPB0
GPB1
GPB2
GPB3
INTA
GPB4
SO
CS
GPB5
GPB6
GPB7
SCK
GPA7
GPA6
GPA5
GPA4
GPA3
GPA2
GPA1
GPA0
VDD
VSS
A2
A1
A0
SI
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
MCP23S17
INTB
RESET
MCP23S17
MCP23
017
QFN
2
3
4
5
6
1
7
VSS
CS
15
16
17
18
19
20
21
GPA4
GPA3
GPA2
GPA1
GPA0
VDD
INTB
SI
SO
A0
A1
A2
RESE
T
23
24
25
26
27
28
22
GPB
3
GPB
2
GPB
1
GPB
0
GP
A7
GP
A6
GP
A5
1011
8 9
121314
MCP23S17
GPB5
GPB6
GPB7
GPB4
INTA
SCK
PDIP,
SSOP
SOIC,
16-Bit I/O Expander with Serial Interface
相关PDF资料
PDF描述
MNT-102-BK-G CONN SHUNT 4POS
MCP23017-E/SO IC I/O EXPANDER I2C 16B 28SOIC
MCP23S08-E/SS IC I/O EXPANDER SPI 8B 20SSOP
MC9S12XDP512VAG IC MCU 512K FLASH 144-LQFP
MC9S12XDT512MAL IC MCU 512K FLASH 112-LQFP
相关代理商/技术参数
参数描述
MCP23017T-E/ML 功能描述:接口-I/O扩展器 16bit Input/Output Exp I2C interface RoHS:否 制造商:NXP Semiconductors 逻辑系列: 输入/输出端数量: 最大工作频率:100 kHz 工作电源电压:1.65 V to 5.5 V 工作温度范围:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体:HVQFN-16 封装:Reel
MCP23017T-E/SO 功能描述:接口-I/O扩展器 16bit Input/Output Exp I2C interface RoHS:否 制造商:NXP Semiconductors 逻辑系列: 输入/输出端数量: 最大工作频率:100 kHz 工作电源电压:1.65 V to 5.5 V 工作温度范围:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体:HVQFN-16 封装:Reel
MCP23017T-E/SP 制造商:MICROCHIP 制造商全称:Microchip Technology 功能描述:16-Bit I/O Expander with Serial Interface
MCP23017T-E/SS 功能描述:接口-I/O扩展器 16bit Input/Output Exp I2C interface RoHS:否 制造商:NXP Semiconductors 逻辑系列: 输入/输出端数量: 最大工作频率:100 kHz 工作电源电压:1.65 V to 5.5 V 工作温度范围:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体:HVQFN-16 封装:Reel
MCP23018 制造商:MICROCHIP 制造商全称:Microchip Technology 功能描述:16-Bit I/O Expander with Open-Drain Outputs