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| 型号： | MCP3004-I/P |
| 厂商： | Microchip Technology |
| 文件页数： | 16/40页 |
| 文件大小： | 0K |
| 描述： | IC ADC 10BIT 2.7V 4CH SPI 14DIP |
| 标准包装： | 30 |
| 位数： | 10 |
| 采样率（每秒）： | 200k |
| 数据接口： | 串行，SPI? |
| 转换器数目： | 1 |
| 电压电源： | 单电源 |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 通孔 |
| 封装/外壳： | 14-DIP（0.300"，7.62mm） |
| 供应商设备封装： | 14-PDIP |
| 包装： | 管件 |
| 输入数目和类型： | 4 个单端，单极；2 个伪差分，单极 |
| 产品目录页面： | 672 (CN2011-ZH PDF) |
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2008 Microchip Technology Inc.
DS21295D-page 23
MCP3004/3008
6.4
Layout Considerations
When laying out a printed circuit board for use with
analog components, care should be taken to reduce
noise wherever possible. A bypass capacitor should
always be used with this device and should be placed
as close as possible to the device pin. A bypass
capacitor value of 1 F is recommended.
Digital and analog traces should be separated as much
as possible on the board, with no traces running
underneath the device or bypass capacitor. Extra
precautions should be taken to keep traces with high-
frequency signals (such as clock lines) as far as
possible from analog traces.
Use of an analog ground plane is recommended in
order to keep the ground potential the same for all
devices on the board. Providing VDD connections to
devices in a “star” configuration can also reduce noise
by eliminating return current paths and associated
errors (see Figure 6-4). For more information on layout
tips when using A/D converters, refer to AN688,
“Layout Tips for 12-Bit A/D Converter Applications”
.
FIGURE 6-4:
VDD traces arranged in a
‘Star’ configuration in order to reduce errors
caused by current return paths.
6.5
Utilizing the Digital and Analog
Ground Pins
The MCP3004/3008 devices provide both digital and
analog ground connections to provide additional
means of noise reduction. As is shown in Figure 6-5,
the analog and digital circuitry is separated internal to
the device. This reduces noise from the digital portion
of the device being coupled into the analog portion of
the device. The two grounds are connected internally
through the substrate which has a resistance of 5 -10.
If no ground plane is utilized, both grounds must be
connected to VSS on the board. If a ground plane is
available, both digital and analog ground pins should
be connected to the analog ground plane. If both an
analog and a digital ground plane are available, both
the digital and the analog ground pins should be
connected to the analog ground plane. Following these
steps will reduce the amount of digital noise from the
rest of the board being coupled into the A/D converter.
FIGURE 6-5:
Separation of Analog and
Digital Ground Pins.
VDD
Connection
Device 1
Device 2
Device 3
Device 4
MCP3004/08
Analog Ground Plane
DGND
AGND
VDD
0.1 F
Substrate
5 - 10
Digital Side
-SPI Interface
-Shift Register
-Control Logic
Analog Side
-Sample Cap
-Capacitor Array
-Comparator
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相关代理商/技术参数 |
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|---|---|
| MCP3004T | 制造商:MICROCHIP 制造商全称:Microchip Technology 功能描述:2.7V 4-Channel/8-Channel 10-Bit A/D Converters with SPI Serial Interface |
| MCP3004T-I/P | 制造商:MICROCHIP 制造商全称:Microchip Technology 功能描述:2.7V 4-Channel/8-Channel 10-Bit A/D Converters with SPI⑩ Serial Interface |
| MCP3004T-I/SL | 功能描述:模数转换器 - ADC 10-bit SPI 4 Chl IND TEMP, SOIC14 RoHS:否 制造商:Texas Instruments 通道数量:2 结构:Sigma-Delta 转换速率:125 SPs to 8 KSPs 分辨率:24 bit 输入类型:Differential 信噪比:107 dB 接口类型:SPI 工作电源电压:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-32 |
| MCP3004T-I/ST | 功能描述:模数转换器 - ADC 10-bit SPI 4 Chl IND TEMP, TSSOP14 RoHS:否 制造商:Texas Instruments 通道数量:2 结构:Sigma-Delta 转换速率:125 SPs to 8 KSPs 分辨率:24 bit 输入类型:Differential 信噪比:107 dB 接口类型:SPI 工作电源电压:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-32 |
| MCP3008 | 制造商:MICROCHIP 制造商全称:Microchip Technology 功能描述:MCP300X 10-Bit Analog-to-Digital Converters |
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