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| 型号： | MCP3901A0T-I/ML |
| 厂商： | Microchip Technology |
| 文件页数： | 17/30页 |
| 文件大小： | 0K |
| 描述： | IC AFE 24BIT 64KSPS 20-QFN |
| 标准包装： | 3,300 |
| 位数： | 24 |
| 通道数： | 2 |
| 电压 - 电源，模拟： | 4.5 V ~ 5.5 V |
| 电压 - 电源，数字： | 2.7 V ~ 5.5 V |
| 封装/外壳： | 20-VFQFN 裸露焊盘 |
| 供应商设备封装： | 20-QFN（4x4） |
| 包装： | 带卷 (TR) |
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PCA2002
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 8 — 25 November 2011
24 of 30
NXP Semiconductors
PCA2002
32 kHz watch circuit with programmable output period and pulse width
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 17.
For further information on temperature profiles, refer to application note AN10365
“Surface mount reflow soldering description”.
14.3.1 Stand off
The stand off between the substrate and the chip is determined by:
The amount of printed solder on the substrate
The size of the solder land on the substrate
The bump height on the chip
The higher the stand off, the better the stresses are released due to TEC (Thermal
Expansion Coefficient) differences between substrate and chip.
Table 17.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (
C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
1.6 to 2.5
260
250
245
> 2.5
250
245
MSL: Moisture Sensitivity Level
Fig 17. Temperature profiles for large and small components
001aac844
temperature
time
minimum peak temperature
= minimum soldering temperature
maximum peak temperature
= MSL limit, damage level
peak
temperature
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