参数资料
型号: MCP4706A0T-E/MAY
厂商: Microchip Technology
文件页数: 23/86页
文件大小: 0K
描述: IC DAC 8BIT NV EEP I2C 6DFN
标准包装: 1
设置时间: 6µs
位数: 8
数据接口: EEPROM,I²C,串行
转换器数目: 1
电压电源: 单电源
功率耗散(最大): 1.1W
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 6-VDFN 裸露焊盘
供应商设备封装: 6-DFN(2x2)
包装: 标准包装
输出数目和类型: 1 电压,单极
采样率(每秒): *
其它名称: MCP4706A0T-E/MAYDKR
2011-2012 Microchip Technology Inc.
DS22272C-page 3
MCP4706/4716/4726
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings
Voltage on VDD with respect to VSS .......................................................................................................... -0.6V to +6.5V
Voltage on all pins with respect to VSS ..............................................................................................-0.3V to VDD + 0.3V
Input clamp current, IIK (VI < 0, VI > VDD) ............................................................................................................±20 mA
Output clamp current, IOK (VO < 0 or VO > VDD) ..................................................................................................±20 mA
Maximum input current source/sunk by SDA, SCL pins .......................................................................................... 2 mA
Maximum output current sunk by SDA Output pin ................................................................................................. 25 mA
Maximum current out of VSS pin .............................................................................................................................50 mA
Maximum current into VDD pin ................................................................................................................................50 mA
Maximum current sourced by the VOUT pin ............................................................................................................40 mA
Maximum current sunk by the VOUT pin..................................................................................................................40 mA
Maximum current sunk by the VREF pin ...................................................................................................................40 A
Package power dissipation (TA = +50°C, TJ = +150°C)
SOT-23-6...................................................................................................................................................452 mW
DFN-6...................................................................................................................................................... 1098 mW
Storage temperature ............................................................................................................................... -65°C to +150°C
Ambient temperature with power applied ............................................................................................... -55°C to +125°C
ESD protection on all pins............................................................................................................................
≥ 6 kV (HBM)
......................................................................................................................................................................
≥ 400V (MM)
Maximum Junction Temperature (TJ) ................................................................................................................... +150°C
Notice: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This
is a stress rating only and functional operation of the device at those or any other conditions above those indicated in
the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended peri-
ods may affect device reliability.
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