参数资料
| 型号： | MCP6004-I/SL |
| 厂商： | Microchip Technology |
| 文件页数： | 31/42页 |
| 文件大小： | 0K |
| 描述： | IC OPAMP QUAD 1.8V 14SOIC |
| 标准包装： | 57 |
| 放大器类型： | 通用 |
| 电路数： | 4 |
| 输出类型： | 满摆幅 |
| 转换速率： | 0.6 V/µs |
| 增益带宽积： | 1MHz |
| 电流 - 输入偏压： | 1pA |
| 电压 - 输入偏移： | 4500µV |
| 电流 - 电源： | 100µA |
| 电流 - 输出 / 通道： | 23mA |
| 电压 - 电源，单路/双路(±)： | 1.8 V ~ 6 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 14-SOIC（0.154"，3.90mm 宽） |
| 供应商设备封装： | 14-SOIC |
| 包装： | 管件 |
| 产品目录页面： | 678 (CN2011-ZH PDF) |
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2009 Microchip Technology Inc.
DS21733J-page 35
MCP6001/1R/1U/2/4
APPENDIX A: REVISION HISTORY
Revision J (November 2009)
The following is the list of modifications:
1.
Added new 2x3 DFN 8-Lead package on
page 1.
2.
Updated the Temperature Specifications table
with 2x3 DFN thermal resistance information.
3.
Updated
4.
Updated Figure 2-15.
5.
Added the 2x3 DFN column to Table 3-1.
6.
Added new
7.
Updated
8.
Updated
9.
Updated
10. Updated
Information” with the new 2x3 DFN package
marking information.
11. Updated the package drawings.
12. Updated the Product Identification System
section with new 2x3 DFN package information.
Revision H (May 2008)
The following is the list of modifications:
1.
Design
Aids:
Name
change
for
Mindi
Simulation Tool.
2.
Package Types: Correct device labeling error.
3.
Electrical Specifications: Changed “Maximum
Output Voltage Swing” condition from 0.9V Input
Overdrive to 0.5V Input Overdrive.
4.
Changed Phase
Margin condition from G = +1 to G= +1 V/V.
5.
Section 5.0 “Design AIDS”: Name change for
Mindi Simulation Tool.
Revision G (November 2007)
The following is the list of modifications:
1.
Updated
notes
to
2.
Increased Absolute Maximum Voltage range at
input pins.
3.
Increased maximum operating supply voltage
(VDD).
4.
Added test circuits.
5.
Added Figure 2-3 and Figure 2-20.
6.
Added
and
7.
Updated
8.
Updated
9.
Updated Package Outline Drawings.
Revision F (March 2005)
The following is the list of modifications:
1.
Updated
Information” to include old and new packaging
examples.
Revision E (December 2004)
The following is the list of modifications:
1.
VOS specification reduced to ±4.5 mV from
±7.0 mV for parts starting with date code
YYWW = 0449
2.
Corrected package markings in
3.
Added Appendix A: Revision History.
Revision D (May 2003)
Undocumented changes.
Revision C (December 2002)
Undocumented changes.
Revision B (October 2002)
Undocumented changes.
Revision A (June 2002)
Original data sheet release.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MCP6004ISN | 制造商:MICROCHIP 制造商全称:Microchip Technology 功能描述:1 MHz Bandwidth Low Power Op Amp |
| MCP6004IST | 制造商:MICROCHIP 制造商全称:Microchip Technology 功能描述:1 MHz Bandwidth Low Power Op Amp |
| MCP6004T-E/LT | 制造商:MICROCHIP 制造商全称:Microchip Technology 功能描述:1 MHz, Low-Power Op Amp |
| MCP6004T-E/MS | 制造商:MICROCHIP 制造商全称:Microchip Technology 功能描述:1 MHz, Low-Power Op Amp |
| MCP6004T-E/OT | 制造商:MICROCHIP 制造商全称:Microchip Technology 功能描述:1 MHz, Low-Power Op Amp |
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