参数资料
型号: MCP6022-E/SN
厂商: Microchip Technology
文件页数: 31/42页
文件大小: 0K
描述: IC OPAMP DUAL 2.5V 10MHZ 8SOIC
标准包装: 100
放大器类型: 通用
电路数: 2
输出类型: 满摆幅
转换速率: 7 V/µs
增益带宽积: 10MHz
电流 - 输入偏压: 1pA
电压 - 输入偏移: 500µV
电流 - 电源: 1mA
电流 - 输出 / 通道: 30mA
电压 - 电源,单路/双路(±): 2.5 V ~ 5.5 V
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 8-SOIC(0.154",3.90mm 宽)
供应商设备封装: 8-SOICN
包装: 管件
产品目录页面: 678 (CN2011-ZH PDF)
2009 Microchip Technology Inc.
DS21685D-page 37
MCP6021/1R/2/3/4
APPENDIX A:
REVISION HISTORY
Revision D (February 2009)
The following is the list of modifications:
1.
Changed all references to 6.0V back to 5.5V
throughout document.
2.
Design Aids: Name change for Mindi Simula-
tion Tool.
3.
Electrical Specifications: Corrected “Maxi-
mum Output Voltage Swing” condition from 0.9V
Input Overdrive to 0.5V Input Overdrive.
4.
Changed Phase
Margin condition from G = +1 to G= +1 V/V.
5.
Changed Settling
Time, 0.2% condition from G = +1 to G = +1 V/V.
6.
Added Section 1.1 Test Circuits.
7.
Mindi Simulation Tool. Added new boards to
Evaluation Boards” and new application notes
8.
Revision C (March 2006)
The following is the list of modifications:
1.
Added SOT-23-5 package option for single op
amps MCP6021 and MCP6021R (E-temp only).
2.
Added MSOP-8 package option for E-temp
single op amp (MCP6021).
3.
Corrected package drawing on front page for
dual op amp (MCP6022).
4.
Clarified spec conditions (ISC, PM and THD+N)
in
Section 2.0
“Typical
Performance
Curves”.
5.
Added Section 3.0 “Pin Descriptions”.
6.
Updated Section 4.0 “Applications informa-
tion” for THD+N, unused op amps, and gain
peaking discussions.
7.
Corrected and updated package marking infor-
mation in Section 6.0 “Packaging Informa-
tion”.
8.
Added Appendix A: “Revision History”.
Revision B (November 2003)
Second Release of this Document
Revision A (November 2001)
Original Release of this Document.
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