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参数资料
| 型号： | MCT0603MC6201FP500 |
| 厂商： | Vishay BC Components |
| 文件页数： | 10/11页 |
| 文件大小： | 0K |
| 描述： | RES 6.2K OHM 0.15W 1% SMD 0603 |
| 标准包装： | 5,000 |
| 系列： | MCT 0603 - 汽车，专业 |
| 电阻（欧姆）： | 6.2k |
| 功率（瓦特）： | 0.15W |
| 复合体： | 薄膜 |
| 温度系数： | ±50ppm/°C |
| 容差： | ±1% |
| 封装/外壳： | 0603（1608 公制） |
| 尺寸/尺寸： | 0.061" L x 0.033" W（1.55mm x 0.85mm） |
| 高度： | 0.022"（0.55mm） |
| 端子数： | 2 |
| 包装： | 带卷 (TR) |
MCS 0402 AT, MCT 0603 AT, MCU 0805 AT, MCA 1206 AT - Professional
www.vishay.com
DIMENSIONS
T t
Vishay Beyschlag
W
W T
H
T b
L
DIMENSIONS AND MASS
TYPE
MCS 0402 AT
MCT 0603 AT
MCU 0805 AT
MCA 1206 AT
H
(mm)
0.32 ± 0.05
0.45 + 0.1/- 0.05
0.52 ± 0.1
0.55 ± 0.1
L
(mm)
1.0 ± 0.05
1.55 ± 0.05
2.0 ± 0.1
3.2 + 0.1/- 0.2
W
(mm)
0.5 ± 0.05
0.85 ± 0.1
1.25 ± 0.15
1.6 ± 0.15
W T
(mm)
> 75 % of W
> 75 % of W
> 75 % of W
> 75 % of W
T t
(mm)
0.2 + 0.1/- 0.15
0.3 + 0.15/- 0.2
0.4 + 0.1/- 0.2
0.5 ± 0.25
T b
(mm)
0.2 ± 0.1
0.3 + 0.15/- 0.2
0.4 + 0.1/- 0.2
0.5 ± 0.25
MASS
(mg)
0.6
1.9
4.6
9.2
SOLDER PAD DIMENSIONS
Z
RECOMMENDED SOLDER PAD DIMENSIONS
WAVE SOLDERING
G
Y
X
REFLOW SOLDERING
TYPE
MCS 0402 AT
MCT 0603 AT
MCU 0805 AT
MCA 1206 AT
G
(mm)
-
0.55
0.80
1.40
Y
(mm)
-
1.10
1.25
1.50
X
(mm)
-
1.10
1.50
1.90
Z
(mm)
-
2.75
3.30
4.40
G
(mm)
0.35
0.65
0.90
1.50
Y
(mm)
0.55
0.70
0.90
1.15
X
(mm)
0.55
0.95
1.40
1.75
Z
(mm)
1.45
2.05
2.70
3.80
Note
? The rated dissipation applies only if the permitted film temperature is not exceeded. Furthermore, a high level of ambient temperature or of
power dissipation may raise the temperature of the solder joint, hence special solder alloys or board materials may be required to maintain
the reliability of the assembly. Specified power rating above 125 °C requires dedicated heat-sink pads, which to a great extend depend on
board materials and design. ?
The given solder pad dimensions reflect the considerations for board design and assembly as outlined e.g. in standards IEC 61188-5-x, or
in publication IPC-7351. They do not guarantee any supposed thermal properties, particularly as these are also strongly influenced by many
other parameters. ?
Still, the given solder pad dimensions will be found adequate for most general applications, e.g. those referring to "standard operation
mode". Please note however that applications for "power operation mode" require special considerations for the design of solder pads and
adjacent conductor areas.
Revision: 22-Jan-14
10
Document Number: 28760
For technical questions, contact: thinfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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| MCT0603MD1000BP100 | 功能描述:薄膜电阻器 - SMD 0.1W 100ohms 0.1% 0603 SMD 25ppm RoHS:否 制造商:AVX 电阻:50 Ohms 容差:2 % 温度系数:150 PPM / C 封装 / 箱体:2010 (5025 metric) 功率额定值:10 W 系列:RP9 电压额定值: 工作温度范围:- 55 C to + 150 C 端接类型:SMD/SMT 尺寸:2.54 mm W x 5.08 mm L x 1.02 mm H 封装:Reel |
| MCT0603MD1000DP500 | 功能描述:薄膜电阻器 - SMD 0.1W 100ohms 0.5% 0603 SMD 25ppm RoHS:否 制造商:AVX 电阻:50 Ohms 容差:2 % 温度系数:150 PPM / C 封装 / 箱体:2010 (5025 metric) 功率额定值:10 W 系列:RP9 电压额定值: 工作温度范围:- 55 C to + 150 C 端接类型:SMD/SMT 尺寸:2.54 mm W x 5.08 mm L x 1.02 mm H 封装:Reel |
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