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| 型号： | MCT0603MD8062DP500 |
| 厂商： | Vishay BC Components |
| 文件页数： | 9/11页 |
| 文件大小： | 0K |
| 描述： | RES 80.6K OHM 0.15W .5% SMD 0603 |
| 标准包装： | 5,000 |
| 系列： | MCT 0603 - 汽车，专业 |
| 电阻（欧姆）： | 80.6k |
| 功率（瓦特）： | 0.15W |
| 复合体： | 薄膜 |
| 温度系数： | ±25ppm/°C |
| 容差： | ±0.5% |
| 封装/外壳： | 0603（1608 公制） |
| 尺寸/尺寸： | 0.061" L x 0.033" W（1.55mm x 0.85mm） |
| 高度： | 0.022"（0.55mm） |
| 端子数： | 2 |
| 包装： | 带卷 (TR) |
MCS 0402 AT, MCT 0603 AT, MCU 0805 AT, MCA 1206 AT - Professional
www.vishay.com
TEST PROCEDURES AND REQUIREMENTS
Vishay Beyschlag
EN 60115-1 ?
CLAUSE
IEC 60068-2
TEST
METHOD
TEST
PROCEDURE
REQUIREMENTS
PERMISSIBLE CHANGE ( ? R )
STABILITY CLASS 0.5 OR BETTER
Stability for product types:
MCS 0402 AT
MCT 0603 AT
MCU 0805 AT
MCA 1206 AT
2.43 ? to 221 k ?
1 ? to 511 k ?
1 ? to 1 M ?
1 ? to 1 M ?
P 70 x R
15 x P 70 x R
4.27
4.37
-
-
Single pulse high
voltage overload:
Standard operation mode
Single pulse high
voltage overload:
Power operation mode
Periodic electric
overload:
Standard operation mode
Periodic electric
overload:
Power operation mode
Severity no. 4:
U = 10 x
U = 2 x U max. ;
whichever is the less severe;
10 pulses 10 μs/700 μs
U =
U = 2 x U max.
whichever is the less severe;
0.1 s on; 2.5 s off;
1000 cycles
± (0.25 % R + 0.05 ?? )
± (0.5 % R + 0.05 ?? )
± (0.5 % R + 0.05 ?? )
± (1.0 % R + 0.05 ?? )
IEC 61340-3-1;
3 pos. + 3 neg.
(equivalent to MIL-STD-883,
4.40
-
Electro Static Discharge
(Human Body Model)
method 3015)
MCS 0402 AT: 500 V
± (0.5 % R + 0.05 ?? )
MCT 0603 AT: 1000 V
MCU 0805 AT: 1500 V
MCA 1206 AT: 2000 V
Endurance by sweeping;
4.22
6 (Fc)
Vibration
10 Hz to 2000 Hz;
no resonance;
amplitude ? 1.5 mm or
?? 200 m/s 2 ; 7.5 h
± (0.1 % R + 0.01 ?? )
no visible damage
Solder bath method;
SnPb40; non-activated flux
(215 ± 3) °C; (3 ± 0.3) s
Good tinning ( ? 95 % covered);
no visible damage
4.17.2
58 (Td)
Solderability
Solder bath method;
SnAg3Cu0.5 or SnAg3.5;
Good tinning ( ?? 95 % covered);
non-activated flux;
(235 ± 3) °C; (2 ± 0.2) s
no visible damage
4.18.2
4.29
4.32
58 (Td)
45 (XA)
21 (Ue 3 )
Resistance to
soldering heat
Component solvent
resistance
Shear (adhesion)
Solder bath method;
(260 ± 5) °C; (10 ± 1) s
Isopropyl alcohol +50 °C;
method 2
RR1005M and RR1608M; 9 N
RR2012M and RR3216M; 45 N
± (0.1 % R + 0.01 ?? )
no visible damage
No visible damage
No visible damage
± (0.1 % R + 0.01 ?? )
4.33
21 (Ue 1 )
Substrate bending
Depth 2 mm, 3 times
no visible damage;
no open circuit in bent position
4.7
4.35
Revision: 22-Jan-14
-
-
Voltage proof
Flammability
U RMS = U ins ; (60 ± 5) s
Needle flame test; 10 s
9
No flashover or breakdown
No burning after 30 s
Document Number: 28760
For technical questions, contact: thinfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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