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参数资料
| 型号： | MCW0406MD1000BP100 |
| 厂商： | Vishay Beyschlag |
| 文件页数： | 8/9页 |
| 文件大小： | 0K |
| 描述： | RES 100 OHM 1/4W .1% 0406 WIDE |
| 标准包装： | 1 |
| 系列： | MCW0406 - 汽车, 精密型 |
| 电阻（欧姆）： | 100 |
| 功率（瓦特）： | 0.25W，1/4W |
| 复合体： | 薄膜 |
| 温度系数： | ±25ppm/°C |
| 容差： | ±0.1% |
| 封装/外壳： | 0604（1610 公制）宽（长侧）0406（1016 公制） |
| 尺寸/尺寸： | 0.039" L x 0.063" W（1.00mm x 1.60mm） |
| 高度： | 0.014"（0.35mm） |
| 端子数： | 2 |
| 包装： | 标准包装 |
| 其它名称： | MCW0406-100-MBDKR |
MCW 0406 AT - Precision
www.vishay.com
DIMENSIONS
T t
Vishay Beyschlag
W
W T
H
T b
L
DIMENSIONS AND MASS
TYPE
MCW 0406 AT
H
(mm)
0.3 ± 0.05
L
(mm)
1.0 ± 0.15
W
(mm)
1.5 ± 0.15
W T
(mm)
> 75 % of W
T t
(mm)
0.2 + 0.1/- 0.15
T b
(mm)
0.2 ± 0.1
MASS
(mg)
1.9
SOLDER PAD DIMENSIONS
G
X
Y
Z
RECOMMENDED SOLDER PAD DIMENSIONS
REFLOW SOLDERING
TYPE
MCW 0406 AT
G
(mm)
0.35
Y
(mm)
0.55
X
(mm)
1.75
Z
(mm)
1.45
Note
? The rated dissipation applies only if the permitted film temperature is not exceeded. Furthermore, a high level of ambient temperature or of
power dissipation may raise the temperature of the solder joint, hence special solder alloys or boardmaterials may be required to maintain
the reliability of the assembly. Specified power rating above 125 °C requires dedicated heat-sink pads, which to a great extend depends on
board materials and design. ?
The given solder pad dimensions reflect the considerations for board design and assembly as outlined e.g. in standards IEC 61188-5-x, or
in publication IPC-7351. They do not guarantee any supposed thermal properties, particularly as these are also strongly influenced by many
other parameters. ?
Still, the given solder pad dimensions will be found adequate for most general applications, e.g. those referring to “standard operation
mode”. Please note however that applications for “power operation mode” or “advanced temperature mode” require special considerations
for the design of solder pads and adjacent conductor areas.
Revision: 29-Jan-14
8
Document Number: 28847
For technical questions, contact: thinfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MCW0406MD1001BP100 | 功能描述:薄膜电阻器 - SMD .25watt 1Kohms .1% 25 PPM RoHS:否 制造商:AVX 电阻:50 Ohms 容差:2 % 温度系数:150 PPM / C 封装 / 箱体:2010 (5025 metric) 功率额定值:10 W 系列:RP9 电压额定值: 工作温度范围:- 55 C to + 150 C 端接类型:SMD/SMT 尺寸:2.54 mm W x 5.08 mm L x 1.02 mm H 封装:Reel |
| MCW0406MD1001DP500 | 制造商:Vishay Intertechnologies 功能描述:MCW0406 Series 1 kO 0.5% 0.25 W 25 ppm/K Wide Terminal Thin Film Chip Resistor |
| MCW0406MD1002BP100 | 功能描述:薄膜电阻器 - SMD .25watt 10Kohms .1% 25 PPM RoHS:否 制造商:AVX 电阻:50 Ohms 容差:2 % 温度系数:150 PPM / C 封装 / 箱体:2010 (5025 metric) 功率额定值:10 W 系列:RP9 电压额定值: 工作温度范围:- 55 C to + 150 C 端接类型:SMD/SMT 尺寸:2.54 mm W x 5.08 mm L x 1.02 mm H 封装:Reel |
| MCW0406MD1003BP100 | 功能描述:薄膜电阻器 - SMD .25watt 100Kohms .1% 25 PPM RoHS:否 制造商:AVX 电阻:50 Ohms 容差:2 % 温度系数:150 PPM / C 封装 / 箱体:2010 (5025 metric) 功率额定值:10 W 系列:RP9 电压额定值: 工作温度范围:- 55 C to + 150 C 端接类型:SMD/SMT 尺寸:2.54 mm W x 5.08 mm L x 1.02 mm H 封装:Reel |
| MCW0406MD1020BP100 | 制造商:Vishay Beyschlag 功能描述:RES 102 OHM 1/4W .1% 0406 WIDE |
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