参数资料
型号: MCW0406MD1501BP100
厂商: Vishay Beyschlag
文件页数: 7/9页
文件大小: 0K
描述: RES 1.5K OHM 1/4W .1% 0406 WIDE
标准包装: 1
系列: MCW0406 - 汽车, 精密型
电阻(欧姆): 1.5k
功率(瓦特): 0.25W,1/4W
复合体: 薄膜
温度系数: ±25ppm/°C
容差: ±0.1%
封装/外壳: 0604(1610 公制)宽(长侧)0406(1016 公制)
尺寸/尺寸: 0.039" L x 0.063" W(1.00mm x 1.60mm)
高度: 0.014"(0.35mm)
端子数: 2
包装: 标准包装
其它名称: MCW0406-1.50K-MBDKR
MCW 0406 AT - Precision
www.vishay.com
TEST PROCEDURES AND REQUIREMENTS
Vishay Beyschlag
EN ?
60115-1 ?
CLAUSE
IEC
60068-2
TEST
METHOD
TEST
PROCEDURE
REQUIREMENTS
PERMISSIBLE CHANGE ( ? R )
Stability for product types:
MCW 0406 AT
Endurance by sweeping;
1 ? to 100 k ?
4.22
6 (Fc)
Vibration
10 Hz to 2000 Hz;
no resonance;
amplitude ? 1.5 mm or
?? 200 m/s 2 ; 7.5 h
± (0.05 % R + 0.01 ?? )
no visible damage
Solder bath method;
SnPb40; non-activated flux
(215 ± 3) °C; (3 ± 0.3) s
Good tinning ( ? 95 % covered);
no visible damage
4.17.2
58 (Td)
Solderability
Solder bath method;
SnAg3Cu0.5 or SnAg3.5;
Good tinning ( ?? 95 % covered);
non-activated flux;
(235 ± 3) °C; (2 ± 0.2) s
no visible damage
4.18.2
4.29
4.32
4.33
4.7
4.35
58 (Td)
45 (XA)
21 (Ue 3 )
21 (Ue 1 )
-
-
Resistance to
soldering heat
Component solvent
resistance
Shear (adhesion)
Substrate bending
Voltage proof
Flammability
Solder bath method;
(260 ± 5) °C; (10 ± 1) s
Isopropyl alcohol +50 °C;
method 2
RR 1016M; 9 N
Depth 2 mm, 3 times
U RMS = U ins ; (60 ± 5) s
Needle flame test; 10 s
± (0.1 % R + 0.02 ? )
no visible damage
No visible damage
No visible damage
± (0.05 % R + 0.01 ?? )
no visible damage; no open circuit in bent position
No flashover or breakdown
No burning after 30 s
Revision: 29-Jan-14
7
Document Number: 28847
For technical questions, contact: thinfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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