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| 型号： | MCZ33298EGR2 |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 24/28页 |
| 文件大小： | 0K |
| 描述： | IC SWITCH 8X LOSIDE W/SPI 24SOIC |
| 标准包装： | 1,000 |
| 系列： | * |
| 应用： | * |
| 接口： | * |
| 电源电压： | * |
| 封装/外壳： | 24-SOIC（0.295"，7.50mm 宽） |
| 供应商设备封装： | 24-SOIC |
| 包装： | 带卷 (TR) |
| 安装类型： | 表面贴装 |
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Analog Integrated Circuit Device Data
Freescale Semiconductor
5
33298
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ARCHIVE
INFORMATION
ARCHIVE
INFORMATION
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 3. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Rating
Symbol
Value
Unit
Power Supply Voltage
Normal Operation (Steady-state)
Transient Conditions(1)
VPWR(SS)
VPWR(PK)
- 1.5 to 26.5
- 13 to 60
V
Logic Supply Voltage(2)
VDD
- 0.3 to 7.0
V
Input pin Voltage(3)
VIN
- 0.3 to 7.0
V
Output Clamp Voltage(4)
2.0mA
≤ IOUT ≤ 0.5A
VOUT(OFF)
50 to 75
V
Output Self-Limit Current
IOUT(LIM)
3.0 to 6.0
A
Continuous Per Output Current(5)
IOUT(CONT)
1.0
A
ESD Voltage(6)
Human Body Model(7)
Machine Model(7)
VESD1
VESD2
2000
200
V
Output Clamp Energy(8)
Repetitive:
TJ = 25°C
TJ = 124°C
Non-Repetitive:
TJ = 25°C
TJ = 124°C
ECLAMP
100
30
2.0
0.5
mJ
J
Recommended Frequency of SPI Operation(9)
fSPI
2.0
MHz
Storage Temperature
TSTG
- 55 to 150
°C
Peak Package Reflow Temperature During Reflow(10),(11)
TPPRT
°C
Notes
1.
Transient capability with external 100
Ω resistor in series with VP pin and supply.
2.
Exceeding these limits may cause a malfunction or permanent damage to the device.
3.
Exceeding the limits on SCLK, SI, CS, SFPD, or RST pins may cause permanent damage to the device.
4.
With output OFF.
5.
Continuous output current rating so long as maximum junction temperature is not exceeded. Operation at 125
°C ambient temperature
will require maximum output current computation using package RθJA.
6.
ESD data available upon request.
7.
ESD1 testing is performed in accordance with the Human Body Model (CZap = 200pF, RZap = 1500Ω), ESD2 testing is performed in
accordance with the Machine Model (CZap = 200pF, RZap = 0Ω).
8.
Maximum output clamp energy capability at 150
°C junction temperature using a single non-repetitive pulse method.
9.
Guaranteed and production tested for 2.0MHz SPI operation, but demonstrated to operate to 8.5MHz at 25
°C.
10.
Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
11.
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